Tag Archives | GROUP IV COMPOUND SEMICONDUCTORS

System-in-Package Technology and Global SiP Markets

System-in-Package Technology (SiP) is unique in its ability to combine the principles of electronic circuit design along with that of semiconductor packaging. It is also the only packaging technique that is pitted against SoC, a completely different methodology of integrating multiple functionalities. The simplicity of SiP makes it possible to combine perse functionalities that SoC […]

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