Tag Archives | IC Package Technologies

Multi-Component IC Packaging for the Internet of Things

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled “The Multi-Component IC Packaging Market, 2014 Edition”.  This report covers these important IC package technologies, including stacked packaging, through via technology, 2.5-D and 3-D technologies, and system in package, or SiP. Having all the functionality of a […]

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