3D TSV Market Devices - 3D Through-Silicon-Via Technology Market Report

3D TSV Devices - Global Strategic Business Report

Global Industry Analysts, Date of Publication: Jul 25, 2015, 138 Pages
US$4,500.00
GIA-MCP7927

The global market for 3D TSV Devices is projected to reach US$67.9 billion by 2020, driven by the growing trend to reduce package dimensions of components in electronic systems.

Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining importance as a highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically by employing TSVs. The 3D TSV devices offer numerous benefits in wafer/chip assembly, which include superior performance as compared to conventional techniques, reduction in package size, heterogeneous integration, and superior performance. Driven by the growing demand for innovative, high-performance chip architectures featuring benefits such as superior performance, power consumption and form factor features, 3D TSV technology is making robust progress in the semiconductor industry. The growth in the 3D TSV advanced wafer packaging technology market is currently fuelled by factors such as robust outlook for the Information & Communication Technologies (ICT) sector, expansion in communication services provider (CSP) operations, intensified activity in corporate data centers, and growing proliferation of cloud computing services.

This report analyzes the worldwide markets for 3D TSV Devices in US$ Million. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Market data and analytics are derived from primary and secondary research. 

Snapshot Summary of Trends & Drivers

  • Demand for Innovative Chip Architectures Spurs Adoption of 3D TSV in the Semiconductor Industry
  • Growing ICT Sector Drives Growth in the 3D TSV Advanced Wafer Packaging Technology Market
  • Proliferation of Cloud-Based Applications Encourages the Adoption of 3D TSV Devices
  • 3D TSV Gains Traction in the DRAM Memory Sector
  • Developments in Smart Lighting Applications Benefit 3D IC Adoption in LED Packaging Solutions
  • Demand for Innovative Databases & Routing Devices Witnesses Upward Trend

Market Analytics

  • Market Estimates and Forecasts for 2013-2020
  • Geographic Regions Covered – The US, Canada, Japan, Europe, Asia-Pacific (China, South Korea, and Rest of Asia-Pacific), and Rest of World

Market Profiling

  • Market Trends & Issues
  • Growth Drivers & Enablers
  • Growth Inhibitors
  • Opportunities and Challenges
  • Recent Industry Activity
  • Product Innovations & Trends
  • Market Analyses, Facts, Figures & Forecasts
  • Coverage of Major & Niche Players
  • Comprehensive Geographic Coverage
  • Extensive Product Coverage


Competitive Intelligence

  • 28 major and niche players covered

Major Players

  • Amkor Technology Inc.
  • Iwate Toshiba Electronics Co. Ltd.
  • Samsung Electronics Co. Ltd.
  • Sony Corporation
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • Teledyne DALSA Inc.
  • Tezzaron Semiconductor Corp.
  • United Microelectronics Corporation (UMC)

TABLE OF CONTENTS

 I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      Prelude                                                           II-1
      Expanding Role of 3D TSV in 3D IC Integration Set to Fuel
       Market Growth                                                    II-2
       Comparison of 3D TSV with Other 3D IC Integration
        Technologies: A Snapshot                                        II-3
      Market Outlook                                                    II-3
      Competitive Scenario                                              II-3
       Market Structure                                                 II-3
        Table 1: Global Semiconductor Fabrication Materials Market
        (2015 & 2020): Annual Sales in US$ Million by Region/Country
        for US, Japan, Europe, China, South Korea, Taiwan and Rest
        of World (includes corresponding Graph/Chart)                   II-4
       Foundries Aim to Stay Ahead in 3D TSV Device Manufacturing       II-4
       IDMs Seek to Include 3D TSV Technology in their Wafer
        Processing Units                                                II-5
        Table 2: Global Silicon Wafers Market (2015 & 2020): Annual
        Sales in US$ Million by Region/ Country for US, Japan,
        Europe, China, South Korea, Taiwan and Rest of World
        (includes corresponding Graph/Chart)                            II-5
       OSATs Compete for Place in 3D TSV Landscape                      II-6
        Advantages & Limitations for Foundries, IDMs, and OSATs
         Operating in 3D TSV Landscape: A Snapshot                      II-6
       TSV Technology to Modify Semiconductor Value Chain               II-6

  2. NOTEWORTHY MARKET TRENDS & GROWTH DRIVERS                          II-7
      Upward Trajectory in Consumer Electronics Sector Boosts Market
       Prospects for 3D TSV Devices                                     II-7
       A Review of Key CE Products Driving Adoption of 3D TSV
        Technology                                                      II-8
        Smartphones                                                     II-8
         Table 3: Global Smartphones Market (2015 & 2020): Annual
         Shipments in Thousand Units by Region/Country for US,
         Canada, Japan, Europe, Asia-Pacific, Middle East & Africa
         and Latin America (includes corresponding Graph/Chart)         II-9
        Tablet PCs                                                      II-9
         Table 4: Global Tablet PC Annual Shipments in Thousand
         Units for Years 2015 through 2020 (includes corresponding
         Graph/Chart)                                                   II-10
      Sustained High Growth in ICT Sector Augurs Well for 3D TSV
       Devices                                                          II-10
       Key Statistical Data                                             II-11
        Table 5: Global IP Traffic Scenario (2014 & 2018): IP
        Traffic Volume in Exabytes (includes corresponding
        Graph/Chart)                                                    II-11

        Table 6: Global IP Traffic Scenario (2014): Percentage
        Breakdown of Internet Usage by Region/Country (includes
        corresponding Graph/Chart)                                      II-11

        Table 7: Global IP Traffic Scenario (2014): Percentage
        Breakdown of Internet Usage by Consumer Segment (includes
        corresponding Graph/Chart)                                      II-12

        Table 8: Global IP Traffic Scenario (2014 & 2018):
        Percentage Breakdown of Traffic Volume by Connection Type
        (includes corresponding Graph/Chart)                            II-12
      Ongoing Proliferation of Cloud-Based Applications to Encourage
       Adoption of 3D TSV Devices                                       II-12
      Growing Performance Requirements of Modern Data Centers to
       Extend Opportunities for 3D TSV Devices                          II-13
       Data Center Traffic Trends: A Complementary Review               II-14
        Table 9: Global Data Center Traffic Scenario (2014 & 2018):
        Data Center Traffic in Exabytes                                 II-15

        Table 10: Global Data Center Traffic Scenario (2014 & 2018):
        Percentage Breakdown of Data Center Traffic by Equipment
        Type (includes corresponding Graph/Chart)                       II-15

        Table 11: Global Cloud Data Center Market (2014 & 2018):
        Percentage Breakdown of Data Center Traffic by Type of Cloud
        (includes corresponding Graph/Chart)                            II-16
      3D TSV Gaining Traction in DRAM Memory Sector                     II-16
       A Review of Next-Generation TSV-based DRAM Memory Solutions      II-17
        Hybrid Memory Cube (HMC)                                        II-17
        High Bandwidth Memory (HBM)                                     II-17
        Wide I/O and Wide I/O 2 DRAM                                    II-18
         Mobile DRAM - LPDDR3 Vs. Wide IO                               II-18
      Growing Market for MEMS to Fuel Market Expansion                  II-18
       Wearable Devices to Extend High-Quality Opportunities            II-19
      3D TSV Devices Sense large Opportunities in CMOS Image Sensors
       Vertical                                                         II-20
       Table 12: Global CMOS Image Sensor (CIS) Package Solutions
       Market (2014): Percentage Share Breakdown of Volume Shipments
       by Technology (includes corresponding Graph/Chart)               II-21
       Use of CMOS Image Sensor (CIS) by Sector & Device/Equipment      II-21
      Imaging & Optoelectronics: An Important End-Use Segment for 3D
       TSV                                                              II-21
      3D TSV Sees Growth in Advanced LED Packaging                      II-21
      3D WLCSP: A Mature 3D TSV Segment                                 II-22
      DRIE Bosch Process Gaining Prominence in TSV Implementation       II-22
      System-Level Exploration and 3D Floorplanning Technique
       Enhance Performance of 3D IC Devices                             II-22
      Demand for Innovative Databases and Routing Devices Witnesses
       Upward Trend                                                     II-23
      Evolving 3D IC Technology Spurs Demand for innovative Tools       II-23

  3. PRODUCT/TECHNOLOGY OVERVIEW                                        II-25
      Introduction                                                      II-25
      Various Steps in TSV Process                                      II-25
      Types of TSV Processes                                            II-25
       Via-First Method                                                 II-25
       Via-Middle Method                                                II-26
       Via-Last Method                                                  II-26
      Methods for Making Via-Holes in TSV                               II-26
       DRIE Method                                                      II-26
       Laser Drilling Method                                            II-26
      Benefits of 3D TSV Devices                                        II-27
       Superior Performance as Compared to Conventional Techniques      II-27
       Reduction in Package Size/Form Factor                            II-27
       Heterogeneous Integration                                        II-27
      Issues                                                            II-28
       High Costs                                                       II-28
       Yield Loss During Process Flow                                   II-28
       Lack of Full-Fledged Design & Verification Tools                 II-28
       Lack of Full Support for Known Good Die                          II-28
      Technological Developments                                        II-28
       Conformal Seeds/Barriers                                         II-29
       Atomic Layer Deposition and Chemical Vapor Deposition            II-30
       Conformal Atomic Layer Deposition Barrier                        II-30
       Electroless Cu Plating                                           II-31

  4. PRODUCT INTRODUCTIONS/LAUNCHES                                     II-32
      AI Technology Unveils 3D-TSV Ultra-Thin Wafer Processing
       Temporary Bonding Adhesive Film                                  II-32
      SK Hynix Announces Commercial Launch of HBM1 DRAM Memory          II-32
      Invensas Develops New 3D-IC, LED & Mobility Designs               II-32
      SK Hynix Unveils HBM DRAM with TSV Technology                     II-32
      SK Hynix Introduces 20nm 128GB DDR4 Memory Chip                   II-32
      Samsung Unveils Widcon Technology                                 II-32
      Hybrid Memory Cube Consortium Rolls Out Hybrid Memory Cube 1.0
       Standard                                                         II-33
      GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm
       Technology                                                       II-33
      STATS ChipPAC and UMC Introduces 3D IC                            II-33

  5. RECENT INDUSTRY ACTIVITY                                           II-34
      GLOBALFOUNDRIES Acquires Microelectronics Business of IBM         II-34
      Sony to Increase the CMOS IS Production Capacity of Sony
       Semiconductor                                                    II-34
      STATS ChipPAC to Relocate STATS ChipPAC Shanghai                  II-34
      A*STAR’s IME Establishes High-Density FOWLP Consortium            II-34
      Tessera Technologies Signs Technology & Patent License
       Agreements with Micron Technology                                II-34
      Tessera’s Subsidiaries Tessera and Invensas Ink Patent License
       Agreements with Samsung                                          II-35
      SPTS Technologies Inks Agreement with CEA-Leti                    II-35
      CEA-Leti Procures Rudolph Technologies’ NSX® 320 TSV Metrology
       System                                                           II-35
      GS Nanotech to Commence Mass Assembly of 3D Stacked TSV           II-35
      Samsung Electronics Commences Mass Production of 64GB DDR4 RDIMMs II-35
      TSMC to Partner with Micron on 3D ICs                             II-35
      Qualcomm Signs Agreement with CEA-Leti                            II-36
      Invensas Partners with Tezzaron Semiconductor                     II-36
      AMD Teams Up with SK Hynix                                        II-36
      CEA-Leti Teams Up with EV Group                                   II-36

  6. FOCUS ON SELECT GLOBAL PLAYERS                                     II-37
      Amkor Technology, Inc. (US)                                       II-37
      GLOBALFOUNDRIES (US)                                              II-37
      Invensas Corporation (US)                                         II-37
      Iwate Toshiba Electronics Co., Ltd. (Japan)                       II-38
      Micron Technology, Inc. (US)                                      II-38
      Samsung Electronics Co., Ltd. (South Korea)                       II-39
      SK Hynix Inc. (South Korea)                                       II-39
      Sony Corporation (Japan)                                          II-40
      STATS ChipPAC Ltd. (Singapore)                                    II-40
      Taiwan Semiconductor Manufacturing Company Limited (TSMC) (
       Taiwan)                                                          II-40
      Teledyne DALSA Inc. (Canada)                                      II-41
      Tezzaron Semiconductor Corp. (US)                                 II-41
      United Microelectronics Corporation (UMC) (Taiwan)                II-41
      Xilinx Inc. (US)                                                  II-42

  7. GLOBAL MARKET PERSPECTIVE                                          II-43
      Table 13: World Recent Past, Current and Future Analysis for
      3D TSV Devices by Geographic Region - US, Canada, Japan,
      Europe, Asia-Pacific (excluding Japan), and Rest of World
      Markets Independently Analyzed with Annual Revenues in US$
      Million for Years 2013 through 2020 (includes corresponding
      Graph/Chart)                                                      II-43

      Table 14: World 8-Year Perspective for 3D TSV Devices by
      Geographic Region - Percentage Breakdown of Dollar Revenues
      for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
      and Rest of World Markets for Years 2013, 2015 and 2020
      (includes corresponding Graph/Chart)                              II-44


 III. MARKET

  1. THE UNITED STATES                                                  III-1
      A.Market Analysis                                                 III-1
        Outlook                                                         III-1
        Soaring Demand for Performance-Rich Consumer Electronics
         Puts Focus on 3D TSV Devices                                   III-1
         Opportunity Indicators                                         III-1
          Table 15: US Smartphones Market (2015-2020): Annual
          Shipments in Thousand Units (includes corresponding
          Graph/Chart)                                                  III-1

          Table 16: US Tablet PC Market (2010-2020): Annual
          Shipments in Thousand Units (includes corresponding
          Graph/Chart)                                                  III-2
        Growing Demand for MEMS Technologies in Mobile & Automotive
         Sector to Create Opportunities for 3D TSV Devices              III-2
        Market Poised to Benefit from Growing Adoption in DRAM
         Memory Sector                                                  III-3
        Product Launches                                                III-3
        Strategic Corporate Developments                                III-4
        Select Players                                                  III-5
      B.Market Analytics                                                III-8
        Table 17: US Recent Past, Current and Future Analysis for 3D
        TSV Devices Market Analyzed with Annual Revenues in US$
        Million for Years 2013 through 2020 (includes corresponding
        Graph/Chart)                                                    III-8

  2. CANADA                                                             III-9
      A.Market Analysis                                                 III-9
        Outlook                                                         III-9
        Teledyne DALSA Inc. - A Major Canadian Player                   III-9
      B.Market Analytics                                                III-10
        Table 18: Canadian Recent Past, Current and Future Analysis
        for 3D TSV Devices Market Analyzed with Annual Revenues in
        US$ Million for Years 2013 through 2020 (includes
        corresponding Graph/Chart)                                      III-10

  3. JAPAN                                                              III-11
      A.Market Analysis                                                 III-11
        Outlook                                                         III-11
        3D TSV Devices Aim to Penetrate Japanese Semiconductors Sector  III-11
         Opportunity Indicators                                         III-11
          Table 19: Japanese Semiconductor Fabrication Materials
          Market (2015-2020): Annual Sales in US$ Million (includes
          corresponding Graph/Chart)                                    III-11

          Table 20: Japanese Silicon Wafers Market (2015-2020):
          Annual Sales in US$ Million (includes corresponding
          Graph/Chart)                                                  III-12
        Strategic Corporate Development                                 III-12
        Select Players                                                  III-12
      B.Market Analytics                                                III-13
        Table 21: Japanese Recent Past, Current and Future Analysis
        for 3D TSV Devices Market Analyzed with Annual Revenues in
        US$ Million for Years 2013 through 2020 (includes
        corresponding Graph/Chart)                                      III-13

  4. EUROPE                                                             III-14
      A.Market Analysis                                                 III-14
        Outlook                                                         III-14
        Strategic Corporate Developments                                III-14
      B.Market Analytics                                                III-15
        Table 22: European Recent Past, Current and Future Analysis
        for 3D TSV Devices Market Analyzed with Annual Revenues in
        US$ Million for Years 2013 through 2020 (includes
        corresponding Graph/Chart)                                      III-15

  5. ASIA-PACIFIC                                                       III-16
       Market Analysis                                                  III-16
        Table 23: Asia-Pacific Recent Past, Current and Future
        Analysis for 3D TSV Devices by Geographic Region - China,
        South Korea and Rest of Asia-Pacific Markets Independently
        Analyzed with Annual Revenues in US$ Million for Years 2013
        through 2020 (includes corresponding Graph/Chart)               III-16

        Table 24: Asia-Pacific 8-Year Perspective for 3D TSV Devices
        by Geographic Region - Percentage Breakdown of Dollar
        Revenues for China, South Korea and Rest of Asia-Pacific
        Markets for Years 2013, 2015 and 2020 (includes
        corresponding Graph/Chart)                                      III-17

  5a. CHINA                                                             III-18
      A.Market Analysis                                                 III-18
        Outlook                                                         III-18
        Booming Semiconductor Market Augurs Well for 3D TSV Devices     III-18
         Opportunity Indicators                                         III-19
          Table 25: Chinese Semiconductor Fabrication Materials
          Market (2015-2020): Annual Sales in US$ Million (includes
          corresponding Graph/Chart)                                    III-19

          Table 26: Chinese Silicon Wafers Market (2015-2020):
          Annual Sales in US$ Million (includes corresponding
          Graph/Chart)                                                  III-19
        Strategic Corporate Development                                 III-20
      B.Market Analytics                                                III-20
        Table 27: Chinese Recent Past, Current and Future Analysis
        for 3D TSV Devices Market Analyzed with Annual Revenues in
        US$ Million for Years 2013 through 2020 (includes
        corresponding Graph/Chart)                                      III-20

  5b. SOUTH KOREA                                                       III-21
      A.Market Analysis                                                 III-21
        Outlook                                                         III-21
        3D TSV Devices Seek Role in the Sprawling Domestic
         Semiconductor Sector                                           III-21
         Opportunity Indicators                                         III-21
          Table 28: South Korean Semiconductor Fabrication Materials
          Market (2015-2020): Annual Sales in US$ Million (includes
          corresponding Graph/Chart)                                    III-21

          Table 29: South Korean Silicon Wafers Market (2015-2020):
          Annual Sales in US$ Million (includes corresponding
          Graph/Chart)                                                  III-22
        Product Launches                                                III-22
        Strategic Corporate Development                                 III-23
        Select Players                                                  III-23
      B.Market Analytics                                                III-24
        Table 30: South Korean Recent Past, Current and Future
        Analysis for 3D TSV Devices Market Analyzed with Annual
        Revenues in US$ Million for Years 2013 through 2020
        (includes corresponding Graph/Chart)                            III-24

  5c. REST OF ASIA-PACIFIC                                              III-25
      A.Market Analysis                                                 III-25
        Outlook                                                         III-25
        Review of Key Regional Markets                                  III-25
         Taiwan                                                         III-25
          Opportunity Indicators                                        III-26
           Table 31: Taiwan Semiconductor Fabrication Materials
           Market (2015-2020): Annual Sales in US$ Million (includes
           corresponding Graph/Chart)                                   III-26

           Table 32: Taiwan Silicon Wafers Market (2015-2020):
           Annual Sales in US$ Million (includes corresponding
           Graph/Chart)                                                 III-26
         Singapore                                                      III-26
        Product Introduction                                            III-27
        Strategic Corporate Developments                                III-27
        Select Players                                                  III-28
      B.Market Analytics                                                III-29
        Table 33: Rest of Asia-Pacific Recent Past, Current and
        Future Analysis for 3D TSV Devices Market Analyzed with
        Annual Revenues in US$ Million for Years 2013 through 2020
        (includes corresponding Graph/Chart)                            III-29

  6. REST OF WORLD                                                      III-30
       Market Analysis                                                  III-30
        Table 34: Rest of World Recent Past, Current and Future
        Analysis for 3D TSV Devices Market Analyzed with Annual
        Revenues in US$ Million for Years 2013 through 2020
        (includes corresponding Graph/Chart)                            III-30


 IV. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 28 (including Divisions/Subsidiaries - 29)

     The United States (10)
     Canada (1)
     Japan (3)
     Europe (5)
     - France (1)
     - Germany (1)
     - The United Kingdom (1)
     - Rest of Europe (2)
     Asia-Pacific (Excluding Japan) (9)
     Middle East (1)
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Date of Publication:
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