RESEARCH INDEX RESEARCH INDEX

       

The Bestselling New Releases in Technology & Market Research

DIS-EUR-2015
US$6,600.00 (5,948.89)
Date of Publication: Jul 30, 2015

The report is an in-depth study prepared by people who have a deep involvement with the electronic component industry. Each country report is written by locals who have detailed knowledge of the electronic component distribution industry. These reports analyse the market split into semiconductors, passives and electromechanical components and component assemblies. The 2015 report contains details of the overall European and International component distribution scene, with profiles of major pan-European groups: Acal, Arrow, Avnet, Electrocomponents, Future, Farnell, Mouser, MSC, Rutronik and TTI. The 1000 plus page Report, contains the following information for Austria, Benelux, Czech Republic, Denmark, Finland, France, Germany, Hungary, Iberia, Italy, Norway, Poland, Russia, Sweden, Switzerland and UK.


IPC-J-STD-001F-DE
US$223.00 (201.00)
Date of Publication: Jul 30, 2015
IPC J-STD-001F ist weltweit anerkannt als einzige, im Industrie-Konsens entwickelte Richtlinie für Lötmaterialien und -prozesse. Diese Ausgabe umfasst die Unterstützung für herkömmliche Lotlegierungen und für bleifreie Produktion. Beispiele für einige der wichtigsten Änderungen sind die Überarbeitung der Verfüllanforderungen für durchmetallisierte Löcher (PTH): Kriterien für zwei neue SMT-Anschlusstypen und erweiterte Konformitäts-Kriterien für die Schutzbeschichtung. Wenn möglich wurden die Beschreibungen der Kriterien überarbeitet, um die Anforderungen an Materialien, Methoden und Überprüfungen zur Produktion hochwertiger Lötverbindungen und Baugruppen leichter verstehen zu können.

PT4750
US$3,650.00 (3,289.92)
Date of Publication: Jul 30, 2015
The report also addresses Visible Light Communications (VLC) as an advanced technology for the ITS development, emphasizing that VLC is defined by the industry as a 5G technology. Details of VLC technological advances, its multiple ITS-related applications, market data and the survey of major industry players are also included. The report is also analyzing advances in driverless car developments as a part of ITS progress related to the 5G evolution. Major driverless car features, standardization and the most important projects with multiple players’ products are analyzed. Benefits and issues of such cars commercial introduction are addressed. It is expected that by 2040 about 65%-70% of all cars on the roads will be driverless.

IPC-A-610F-CN
US$152.00 (137.00)
Date of Publication: Jul 30, 2015
The scope of the industry standards for the collection of visual quality acceptability requirements on electronic components. This standard does not provide guidelines for the cross-sectional assessment. This document describes the manufacture of electrical and electronic components acceptance requirements. From a historical perspective, electronic assembly standards include guidelines more widely within the industry and technology involved. Therefore, in order to more fully understand the recommendations and requirements of this document, which can use IPC-HDBK-001, IPC-AJ-820 and IPC J-STD-001 when the application of this document. The requirements of this standard, neither intended to define the purpose of the assembly operation to complete the process, but also not intended as a repair / modify or alter authorized products. For example: The standard components in the bonding requirement does not imply, or approval of, or necessarily require the use of adhesive bonding; lead clockwise winding terminals description is not intended, or approved, or must require that all leads / clockwise winding wires have. Users of this standard should have some knowledge in order to be able to understand the applicable requirements of documents and how to apply. It should be retained with the objective evidence to prove this knowledge. When there is no objective evidence, companies should consider the skills of employees is reviewed regularly to determine proper eye test income requirements. IPC-A-610 contains the operating method IPC J-STD-001 included in the scope, the relevant requirements of mechanical assembly and other processes beyond the requirements. Table 1-1 lists the relevant documents.

IPC-A-610F-DE
US$223.00 (201.00)
Date of Publication: Jul 30, 2015

IPC-A-610 ist die weltweit am meisten verwendete Richtlinie zur Elektronik-Montage. Die IPC-A-610F, ein Muss für alle Qualitätssicherungs- und Montageabteilungen, illustriert anerkannte Abnahmekriterien für die Verarbeitungsqualität elektronischer Baugruppen. Sie enthält detaillierte Angaben über sowohl zulässige Zustände als auch Fehlerzustände und wird durch farbige Bilder und Illustrationen unterstützt. Diese Ausgabe beinhaltet zwei neue SMT-Anschlussarten sowie geänderte Kriterien bezüglich des Füllgrades durchmetallisierter Löcher und bezüglich Hohlräumen (Voids) bei BGA-Lötstellen. Darüber hinaus wurden, wo möglich, Formulierungen angepasst, um die Lesbarkeit zu verbessern und die Verständlichkeit zu erhöhen, ohne dabei Anforderungen zu entfernen.


IPC-A-610F-RU
US$212.00 (191.09)
Date of Publication: Jul 30, 2015
IPC-A-610 является наиболее широко используемым в мире стандартом по сборке электроники. Являясь обязательным для всех отделов обеспечения качества и сборки, IPC-A-610F иллюстрирует принятые отраслью критерии качества для электронных сборок, посредством детально описанных условий приемлемости и дефекта, подкрепленных полноцветными фотографиями и иллюстрациями. Это издание включает в себя два новых типа контакта ТПМ, а также изменения в критериях для заполнения металлизированных отверстий и пустот в паяных соединениях BGA. Кроме того, формулировки по возможности были изменены, чтобы облегчить восприятие текста и повысить понимание - и все это без удаления каких-либо требований.

IPC-A-610F-VN
US$152.00 (137.00)
Date of Publication: Jul 30, 2015
IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghiệp chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh họa màu sắc. Phiên bản này bao gồm hai kiểu bản cực SMT, cũng như những thay đổi ở các tiêu chuẩn chấp nhận cho yêu cầu điền chất hàn vào lỗ đâm xuyên có mạ và yêu cầu về lỗ rỗng cho các banh hàn của BGA. Thêm vào đó, các sửa đổi về cách thức diễn đạt các chi tiết nhằm làm việc đọc hiểu bộ tài liệu được dễ dàng và dễ hiểu hơn – tất cả những điểm này không loại bỏ đi những yêu cầu.

IPC-A-610F-SP
US$152.00 (137.00)
Date of Publication: Jul 30, 2015
El IPC-A-610 es el estándar de ensambles electrónicos más utilizado del mundo. Es indispensable para todos los departamentos de aseguramiento de calidad y de ensamble, el IPC-A-610F ilustra los criterios de calidad aceptados por la industria para ensambles electrónicos a través de descripciones detalladas reflejando las condiciones aceptables y de defecto, apoyado por fotografías a todo color e ilustraciones. Esta revisión incluye dos nuevos tipos de terminaciones SMT y también cambios en el llenado de orificios through-hole metalizados y en los criterios para vacíos en BGAs. Además, siempre cuando ha sido posible se han modificado las descripciones para facilitar la lectura y mejorar la comprensión - todo sin eliminar ningún requisito.

IPC-A-610F-JP
US$223.00 (201.00)
Date of Publication: Jul 30, 2015
本書はIPCの製品保証分科会(7-30及び7-30C)のタスクグループ(7-31B)、 タスクグループアジア(7-31BC),タスクグループ北欧(7-31BD)、タス クグループドイツ語圏(7-31BDE)そしてタスクグループインド(7-31BI) を含めたIPC-A-610チームにより作成されたものである。 本書は、セレスティカ・ジャパン株式会社及び武井利泰⽒(⽇本精⼯株 式会社)により翻訳され、株式会社ジャパンユニックスにより、改版・監 修が⾏われた。 本書

IDT6448
US$4,495.00 (4,051.56)
Date of Publication: Feb 5, 2015
Industrial and Commercial electric vehicles will be a similar market to Cars but innovating faster and frequently more profitable for all in the value chain. The most important sector is Buses, the subject of this report, where innovation often comes before cars because they are less price sensitive. In this report we show how the Chinese are now dominating the league table, buying the most buses and innovating rapidly already creating the lowest cost base by far. We examine the different power trains and the move from chassis to integrated manufacture often with no chassis and later structural electronics as bodywork will come.

WG7540
US$4,000.00 (3,605.39)
Date of Publication: Jul 27, 2015
The 2015 study has 1022 pages, 258 tables and figures.  Worldwide Industrial Robot markets are poised to achieve significant growth as the  automotive early adopter base provides a way for other industries to leverage economies of scale.  Industrial Robot infrastructure in one industry makes it easier to extend product sets so that they are more available across all industries, remaking all manufacturing everywhere.

ICK4500
US$10,000.00 (9,013.48)
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.