Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$4,950.00
Date of Publication: Jan 18, 2018
This report analyzes the worldwide markets for Fuses and Circuit Breakers in US$ Million. The Global market is analyzed by the following Product Segments: Fuses, and Circuit Breakers. The report also provides US market analytics for the following End-Use Sectors: Utility, Construction, Industrial Machinery, Electrical & Electronics, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East & Africa, and Latin America. Annual estimates and forecasts are provided for the period 2016 through 2024.

US$2,750.00
Date of Publication: Nov 10, 2017

All major vendors of Passive Components are discussed in this report, including AVX/Kyocera Corporation (NYSE: AVX : RIC 6971:), KEMET Electronics (NYSE: KEM): KOA Corporation (RIC: 6999), Nichicon Corporation (RIC 6996); Nippon Chemi-Con Corporation (RIC: 6997), Panasonic Electronic Devices Company Limited (RIC: 6752), Murata Manufacturing Company Limited (RIC: 6981), Rohm Company Limited (RIC 6963) , Rubycon Corporation (Private), Samsung Electro-Mechanical (KSE: 009150):, Sumida Electric Company Limited (RIC: 6817), Taiyo Yuden Corporation (RIC: 6976), TDK Corporation (RIC: 6762), TOKO Inc. (RIC: 6801), Vishay Intertechnology, Inc. (NYSE: VSH), Walsin Technology (TT: 5335) and Yageo Corporation (TW: 2327).


US$2,495.00
Date of Publication: Oct 18, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$3,750.00
Date of Publication: Jul 24, 2017
This market research report addresses the global market for overvoltage and overcurrent circuit protection components consumed in key areas of the automobile. This includes a detailed analysis of automotive Blade Fuses, PTC Thermistors, TVS Diodes and Polymeric ESD suppressors.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$3,750.00
Date of Publication: Jun 6, 2017
Report Highlights: High Capacitance BME MLCC Markets: 27 year historical market analysis on high capacitance MLCC markets worldwide including value, volume and pricing and five year forecasts; demand by region and end-use market segment; production by country; costs to produce; technology roadmapping, growth strategies, competition, deep technology comparative analysis, market shares strategies for moving forward and detailed forecasts to 2022.

US$4,950.00
Date of Publication: May 24, 2017
This report analyzes the worldwide markets for Electronic Components in US$ by the following Product Segments: Resistors (Semi-Fixed Variable, Carbon Variable, Other Variable, Carbon Film Fixed, Metal Film Fixed, Metal Oxide Film Fixed, Wire Wound Fixed, Network, Chip, and Other Fixed), Capacitors (Variable, Aluminum Electrolytic Fixed, Tantalum Electrolytic Fixed, Ceramic Fixed, Film, and Other Fixed), Transformers (RFTS & IFTS, Audio Frequency, Power, High Frequency Power, High Voltage, Flyback, Deflection Yokes, and Other), Resonators, Connectors (PCB, Rectangular I/O, Circular, RF Coaxial, and Other), Relays (Electromechanical, and Solid State), Switches (Toggle, Slide, Rotary, Keyboard, and Other), and Printed Wiring Boards (Single Sided Rigid, Double Sided Rigid, Multilayer Rigid, Flexible, HDI, and Other). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.