Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

Date of Publication: Jun 6, 2017
Report Highlights: High Capacitance BME MLCC Markets: 27 year historical market analysis on high capacitance MLCC markets worldwide including value, volume and pricing and five year forecasts; demand by region and end-use market segment; production by country; costs to produce; technology roadmapping, growth strategies, competition, deep technology comparative analysis, market shares strategies for moving forward and detailed forecasts to 2022.

Date of Publication: May 24, 2017
This report analyzes the worldwide markets for Electronic Components in US$ by the following Product Segments: Resistors (Semi-Fixed Variable, Carbon Variable, Other Variable, Carbon Film Fixed, Metal Film Fixed, Metal Oxide Film Fixed, Wire Wound Fixed, Network, Chip, and Other Fixed), Capacitors (Variable, Aluminum Electrolytic Fixed, Tantalum Electrolytic Fixed, Ceramic Fixed, Film, and Other Fixed), Transformers (RFTS & IFTS, Audio Frequency, Power, High Frequency Power, High Voltage, Flyback, Deflection Yokes, and Other), Resonators, Connectors (PCB, Rectangular I/O, Circular, RF Coaxial, and Other), Relays (Electromechanical, and Solid State), Switches (Toggle, Slide, Rotary, Keyboard, and Other), and Printed Wiring Boards (Single Sided Rigid, Double Sided Rigid, Multilayer Rigid, Flexible, HDI, and Other). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.

Date of Publication: Apr 19, 2017
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

Date of Publication: Mar 28, 2017
This report is designed for end-users of passive electronic components that update their supply chain information regarding capacitors, resistors and inductors on an annual basis. This report offers a granular look at the global and regional markets for 14 sub-types of passive electronic component. This report was designed with input from major purchasers of passive electronic components and in direct response to industry needs.

Date of Publication: Mar 28, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

Date of Publication: Jan 23, 2017
This report studies Solid-State Relay in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, focuses on top manufacturers in the global market, with capacity, production, price, revenue, and market share for each manufacturer.