Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

Date of Publication: Dec 18, 2012

The new Revision H contains updated information on small shrink outline package (SSOP), thin small outline package (TSOP), quad flat pack (QFP), low-profile quad flat pack (LQFP), plastic quad flat package (PQFP), leadless chip carrier (LCC), quad flat no-lead (QFN), and ball grid array (BGA)-related packages, including all the variations within those groups. New components include dual flat no-lead (DFN), quad flat no-lead (QFN) multi-row, package on package (PoP), chip scale package (CSP), chip on board (COB), bare die, and flip chip. In addition, a new section has been added that stresses the dangers of cross contamination when using lead-free components and assemblies. 


Date of Publication: Aug 3, 2015

This market research study analyzes the global markets for both AC plastic film and DC plastic film capacitors. For AC film capacitors the study focuses on the global value of demand for small and large can polypropylene dielectric plastic film capacitors, including both dry and oil-filled designs for use in electrical systems (power transmission and distribution capacitors; motor run capacitors, industrial drive capacitors; renewable energy capacitors; power film capacitors; microwave oven capacitors, magnetic ballast capacitors, and specialty power film capacitors. The second part of the study focuses on DC film capacitors for printed circuit board applications in power supply, lighting ballast, and consumer AV applications, and includes value and volume of demand for 5 mm pitch PET film capacitors; AC & Pulse film capacitors, interference suppression film capacitors and PPS, PEN and PET film chip capacitors; as well as specialty film capacitors for consumption in high temperature electronics.

Date of Publication: Oct 15, 2015
This report analyzes the worldwide markets for Discrete Capacitors in US$ Million by the following End-Use Segments: Telecommunication, Computers & Peripherals, Consumer Electronics, Automotive, Aerospace & Defense, and Industrial & Other Applications. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2014 through 2020. Also, a seven-year historic analysis is provided for these markets.

Date of Publication: Oct 20, 2015
DC circuit breaker, is used for the protection of electrical devices that operate with direct current. Miniature DC crcuit breakers are usually in DC system under 1500V, for power control and overcurrent protection. Currently DC circuit breaker mainly can be divided into two types, Solar DC circuit breakers and general DC circuit breakers. These circuit breakers are mainly used in solar power and electric vehicles, high precision industrial machines and welding, microgrid and DC power distribution networks, lighting and others. The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The Miniature DC Circuit Breaker market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status.

Date of Publication: Oct 2, 2015
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements.

Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

Date of Publication: Oct 1, 2015
Presently, the high-end relay market in China is principally monopolized by foreign brands such as Omron, Panasonic and TE Connectivity, while the low-end market is controlled by local Chinese players like Hongfa Technology, Dongguan Sanyou Electrical Appliances, Zhejiang HKE, Ningbo Forward Relay and Guizhou Space Appliance.