Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$2,750.00
Date of Publication: Sep 18, 2015
This study covers the global market for tantalum materials, including tantalum ores and concentrates and engineered tantalum powder, wire, foil, sheet, bar and rod for consumption in tantalum capacitor anodes, tantalum sputtering targets, superalloys, cemented carbide cutting tools, fabricated mill products and tantalum chemicals and compounds.

US$152.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$4,500.00
Date of Publication: Jul 25, 2015
Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining importance as a highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically by employing TSVs. The 3D TSV devices offer numerous benefits in wafer/chip assembly, which include superior performance as compared to conventional techniques, reduction in package size, heterogeneous integration, and superior performance. Driven by the growing demand for innovative, high-performance chip architectures featuring benefits such as superior performance, power consumption and form factor features, 3D TSV technology is making robust progress in the semiconductor industry.

US$4,950.00
Date of Publication: Jun 16, 2015
This report analyzes the worldwide markets for Electronic Components in US$ Million by the following Product Segments: Resistors (Semi-Fixed Variable, Carbon Variable, Other Variable, Carbon Film Fixed, Metal Film Fixed, Metal Oxide Film Fixed, Wire Wound Fixed, Network Resistors, Chip Resistors, & Other Fixed), Capacitors (Variable, Aluminum Electrolytic Fix, Tantalum Electrolytic Fixed, Ceramic Fixed, Organic Film Fixed, Metallized Organic Film & Other Fixed), Transformers (RFTS & IFTS, Audio Frequency, Power, High Frequency Power, High Voltage, Flyback, Deflection Yokes, & Other), Resonators, Connectors (PCB Connectors, Rectangular I/O Connectors, Circular Connectors, RF Coaxial Connectors, & Other Connectors), Relays (Electromechanical Relays (EMRs), & Solid State Relays (SSRs)), Switches (Toggle, Slide, Rotary, Keyboard, & Other Switches), and Printed Wiring Boards (Single Sided Rigid, Double Sided Rigid, Multilayer Rigid, & Flexible). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$2,750.00
Date of Publication: Jun 9, 2015
This study addresses the FY 2015 world market for Inductors, Beads and Cores. This new report represents the results of substantial data collection on the subject of magnetic components. The study addresses why the global market for discrete inductors is outperforming other passive components in 2015 and why this trend is expected to continue. The study also addresses the impact the weak yen and strong dollar is having on the current market. 

US$2,750.00
Date of Publication: Feb 17, 2014
ESD Suppression Components Markets, Technologies & Opportunities This new report takes a detailed look at the global market for the electronic...