Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$4,250.00
Date of Publication: Dec 28, 2015
The study employs multiple back studies on various individual component markets and their use in automotive electronic sub-assemblies, including ceramic capacitors, tantalum capacitors, aluminum capacitors, DC film capacitors, AC film capacitors, EDLC supercapacitors; high frequency ceramics; thick film chip resistors, resistor networks and arrays, nichrome film resistors, wirewound resistors, tin oxide resistors, carbon resistors, integrated passive devices; discrete inductors including ferrite beads, SMD chip coils and throughole inductors; as well as non linear resistors such as PTC and NTC thermistors and metal oxide varistors. 19 Individual component product lines that are critical to the future of the automobile are discussed in this report.

US$3,750.00
Date of Publication: Jan 15, 2016
The study addresses global market drivers and market challenges for this unique dielectric over the next five years. The study breaks down global value and volume of demand for tantalum capacitors from both an historical and forecast perspective in terms of value, volume and average unit pricing. The study addresses demand by end-use market segment in the computer, telecommunications infrastructure, automotive, consumer AV, wireless handset, defense, medical, instrumentation, industrial and oil& gas industries worldwide. The study also addresses global demand and forecasts by world region; as well as demand by channel of distribution.

US$5,550.00
Date of Publication: Jan 5, 2016

The scope of this report covers many IGBT applications used globally in various types of end industries. The market is broken down into major packaging types, regions, property, applications and end-user industries. Revenue forecasts from 2015 through 2020 are given for each major IGBT type, with their applications and regional market. The report also includes a discussion of the major players in each of the regional markets and explains the major global drivers, the current trends, major challenges and the regional dynamics of the market. The report concludes with a special focus on the supplier landscape. It includes detailed profiles of the major vendors in the global IGBT industry, and it discusses the market share of the major players by region.


US$2,750.00
Date of Publication: Aug 3, 2015

This market research study analyzes the global markets for both AC plastic film and DC plastic film capacitors. For AC film capacitors the study focuses on the global value of demand for small and large can polypropylene dielectric plastic film capacitors, including both dry and oil-filled designs for use in electrical systems (power transmission and distribution capacitors; motor run capacitors, industrial drive capacitors; renewable energy capacitors; power film capacitors; microwave oven capacitors, magnetic ballast capacitors, and specialty power film capacitors. The second part of the study focuses on DC film capacitors for printed circuit board applications in power supply, lighting ballast, and consumer AV applications, and includes value and volume of demand for 5 mm pitch PET film capacitors; AC & Pulse film capacitors, interference suppression film capacitors and PPS, PEN and PET film chip capacitors; as well as specialty film capacitors for consumption in high temperature electronics.


US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$1,800.00
Date of Publication: Jan 13, 2015
PTC Thermistors: World Markets, Technologies & Opportunities: 2015-2019  This report addresses the global market for PTC thermistors in both...