Asia Market

Our market intelligence services and research reports bring Asia-Pacific business intelligence and independent analysis on emerging technologies. This category specially focuses on a wide range of markets in Asia. 

US$3,000.00
Date of Publication: Nov 7, 2018
Aluminum electrolytic capacitor, a core electronic component, is widely used in consumer electronics, computers and peripherals, industry, electric power, lighting and automobiles. Global aluminum electrolytic capacitor production clusters in Japan, South Korea, Taiwan and Mainland China, of which Japan shares half the market.

US$3,400.00
Date of Publication: Nov 7, 2018
Battery management system (BMS), a key part of battery electric and hybrid vehicles, is primarily composed of battery electronics (BE) and battery control unit (BCU), with the former being responsible for collecting current, voltage and temperature data of battery and transmitting them to BCU and the latter for information exchange with other control units.

US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.

US$2,800.00
Date of Publication: Sep 19, 2017
Global OLED market size approximated USD15.7 billion in 2016, a 20.8% rise from a year earlier. Stimulated by reports that Apple will adopt OLED screen for multiple iPhone models in 2017-2018, OLED screen has become a hotspot in the smartphone market. Thanks to the introduction of more than 20 OLED phone models by Huawei, Xiaomi, VIVO, OPPO and other vendors, the demand for OLED has been growing rapidly, expected to create a market worth USD19.4 billion in 2017 and USD39.9 billion in 2021, showing an AAGR of over 20%.

US$2,700.00
Date of Publication: Sep 4, 2017
Photovoltaic glass (PV glass) finds application in solar cell modules, with its development depending on PV industry. Global new PV installed capacity...

US$2,500.00
Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

US$2,300.00
Date of Publication: Jul 24, 2015
China Semiconductor Industry Report Covers: 1. Global Semiconductor Market and Industry; 2. China Semiconductor Market and Industry; 3. Eleven Chinese...