Asia Market

Our market intelligence services and research reports bring Asia-Pacific business intelligence and independent analysis on emerging technologies. This category specially focuses on a wide range of markets in Asia. 

US$4,500.00
Date of Publication: Nov 16, 2017
This study analyzes the Asia/Pacific (excluding Japan) wireless SD-WAN market and provides forecast for this networking segment. As enterprises adopt IoT processes in their internal operations as well as for the products and services they provide, it is becoming clear that the WAN needs to advance to include the important features of bandwidth and lower latency in the evolving wireless broadband technologies such as 4G, 4.5G, 5G, and satellite.

US$4,500.00
Date of Publication: Jun 18, 2017
This study is a translation of the Japanese document that analyzes the current situation on IoT spending and forecasts the spending from 2017 to 2021 in the IoT market for the four technology groups further divided into technical elements (a total of 10 elements), while focusing on the "key use cases" (a total of 36 applications) as defined by IDC. This study also provides recommendations to vendors involved in the IoT business.

US$1,600.00
Date of Publication: Mar 8, 2017
This report presents forecast and recent quarter review of mobile phone shipment volume, shipment value, and APS, and analyzes manufacturer volume rankings, shipment by maker, shipment by branded vendor, and price trend. Also provided are shipment breakdowns by system technology, operating system, display, production location and destination. The content of this report is based on primary data obtained through interviews with Taiwanese mobile phone makers and branded vendors.

US$2,250.00
Date of Publication: Jul 4, 2017
This research report presents shipment volume and value forecasts and recent quarter review of the Taiwanese server industry, comprising of server systems and server motherboards. The report includes server shipment volume, shipment value, ASP, with detailed breakdowns by assembly level (full system, barebones and motherboard), by maker, by price point, and manufacturer volume ranking and product mix.

US$2,700.00
Date of Publication: Sep 4, 2017
Photovoltaic glass (PV glass) finds application in solar cell modules, with its development depending on PV industry. Global new PV installed capacity...

US$7,500.00
Date of Publication: Sep 24, 2015
This study surveys revenue performance in the Japan disk storage system market between 2012 and 2014 by industry and number of employees and presents forecasts for 2015 through 2019. It analyzes industry-specific revenue in the Japan disk storage system market by OS and connection environment from the standpoint of external/internal configurations. The study also analyzes revenue by number of employees from the standpoint of external/internal configurations.

US$2,500.00
Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.