The IC Knowledge - Assembly and Test Cost and Price Model is a brand new cost and price model from the world leader in semiconductor and MEMS cost and price modeling. The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features. This is a complete OSAT model and an ideal companion to our Strategic Cost and Price Model.
Supported assembly processes
Leadframe, organic substrate, wafer level and InFO.
Supported wafer sizes
75mm, 100mm, 125mm, 150mm, 200mm and 300mm.
Supported cost elements
Overall wafer sort, assembly cos and class test cost, cost of each assembly and test step, material usage.
Who should buy this product
The IC Knowledge - Assembly and Test Cost and Price Model is widely used by IDMs, Fabless companies, Analysts, Consultants, Electronics Systems and Automotive Companies and many others. The model is used for benchmarking, evaluating pricing, market research and many other uses. Our model customers include most of the worlds largest IDMs, Fabless and Electronics Systems companies.
Current revision updates:
The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.
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