Development of Chinese and Taiwanese Semiconductor Industry’s Major Sectors, 2014 and Beyond

Development of Chinese and Taiwanese Semiconductor Industry’s Major Sectors, 2014 and Beyond

MIC Taiwan, Date of Publication: Nov 7, 2014, 21 Pages

Development of Chinese and Taiwanese Semiconductor Industry’s Major Sectors, 2014 and Beyond

Taiwan's semiconductor industry still remains ahead of China in terms of shipment value and technology development, but China has been catching up fast, with an aim to beef up the industry with a series of governmental preferential and incentive policies to attract foreign investors. This report outlines the key developments of the semiconductor industry in China and Taiwan, comprising mainly of fabless IC design, IC manufacturing, and packaging & testing industry sectors; examines the major battleground between China and Taiwan in the semiconductor industry while probing into China's incentive policies and consequences thereof on the global semiconductor industry in 2014 and beyond.


  • Chinese and Taiwanese semiconductor industry development, comprising of IC manufacturers, fabless IC design houses, and IC packaging and testing service providers, with market share by price point and by brand vendor
  • Global market rankings of Chinese IC design houses, IC packaging and testing vendors, and IC manufacturers, their annual revenues, and major deliverables
    Highlight of the Chinese smartphone application processor market development and touches on market share by chip supplier, by number of cores per CPU, by CPU model, and also includes the Chinese smartphone market share by branded vendor and by AP supplier in 1H 2014
  • Outline of the Chinese government's strategic policies involving semiconductor and how those policies have affected or will affect the entire semiconductor industry from the
  • Chinese and global perspectives
  • Deployment of Chinese governments in all sectors of semiconductor industry and includes Taiwanese counterparts' strategic planning in China


Allwinner, Apple, ASE, ASMC, BBK, Beijing Industrial Developing Investment Management Cooperation, Bejing KT Micro, China Electronics Cooperation, Coolpad, Country Mate Technology, CR Microelectronics, Datang Semiconductor, Diga Device, Freescale, GalaxyCore, Gionee, Great Wall, Himax, Hisilicon, Hitech, Hua Capital, Huahong NEC, Huawei, Hynix, ILItek, Infineon, Intel, Intel Semiconductor, JCET, LeadCore, Lenovo, Marvell, MediaTek, Micron, Montage, Morningstar, Nantong Huada Microelectronics, Nari Smartchip, Novatek, OmniVision, On-Bright, Oppo, Orise, Panasonic, Panda, Phison, PowerTech, PTL, PuDong, Qualcomm, Raydium, RDA Microelectronics, Realtek, RFMD, Richtek, Rockchip, Samsung, SDIC, Silan, Sino-Microelectronics, SMIC, Solomon, SPIL, Spreadtrum, STATS, Superpix, Tian Shui Hua Tian, Tongfang, TPV, TSMC, UMC, VeriSilicon, Vimicro, Xi'an XIGU Microelectronics, Xiaomi, Zhongguancun Development Group, ZTE



Date of Publication:
Nov 7, 2014
File Format:
PDF via E-mail
Number of Pages:
21 Pages