Circuit Board Assembly PCB Technology Roadmap

Board Assembly - 2015 iNEMI Roadmap

iNEMI, Date of Publication: Apr 7, 2015

Circuit Board Assembly PCB Technology Roadmap

PCB board assembly is a critical part of the overall electronic products’ supply chain.  It accounts for most of the direct material cost, and is closely associated with: Component Packaging, Interconnect, Inspection, Thermal Management, Final Assembly, and Environmental Technologies.

There are four main drivers for development in Board Assembly processes:

  • Conversion Cost Reduction
  • Reduction in New Product Introduction (NPI) Time
  • Increased Component I/O Density
  • Transition to Environmental and Regulatory Requirements

These drivers are affecting business environments, manufacturing technology, and research needs.  One of the profound business environment impacts of the product sector drivers is the higher level of service demands, or opportunities, placed on the contract manufacturers by the Original Equipment Manufacturers (OEM).  Today’s Electronic Manufacturing Service (EMS) companies are expanding their offerings to include services in a wider range of a product’s life cycle, such as product design, HW and SW verification, product support, installation support, and field service support to work as Joint Design Manufacturing (JDM) or Own Design Manufacturing ODM).

The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.

The iNEMI Board Assembly Roadmap identifies major trends in the evolution of technology in PCB assembly, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

The complete report provides a full coverage of emerging and disruptive technologies across the electronics industry: Order 2015 iNEMI Roadmap today.



Date of Publication:
Apr 7, 2015
File Format:
PDF via E-mail