MIC Taiwan

Competitive Trends in the Worldwide IC Manufacturing Industry: Logic IC Process Technology

MIC Taiwan, Date of Publication: Jun 19, 2013, 7 Pages
US$600.00
MIC1791

With the global economic outlook expected to improve in 2013, the semiconductor market is also showing signs of recovery. In addition to business results, leading chipmakers also released plans for capital expenditures and process technology advancement in the first quarter of 2013. Worldwide IC foundries are expected to begin mass production with the 20nm process technology in the second half of 2013, with 14/16nm and 10nm down the road. This progress will give TSMC and GlobalFoundries a chance to catch up with Intel, closing the gap of one to two generations. This report offers insight into major chipmakers' development in logic IC process technology, with their strategies and impact included.


LIST OF TOPICS


Background introduction, touching on current development of Intel, TSMC, and GlobalFoundries
Major IC vendors' plans for logic IC process technology advancement and capital expenditures
The impact of the competition in logic IC process technologies on the worldwide IC manufacturing industry
Companies and organizations analyzed or mentioned in the report include: Altera, ARM, ASML, Broadcom, GlobalFoundries, Intel, MediaTek, Qualcomm, Samsung, SMIC, TSMC, UMC, Xilinx


TABLE OF CONTENTS

1. Leading Vendors Advance Into New Logic IC Process Technologies
2. Process Technology Advancement Spurs Keen Competition for High-end Orders
2.1 Development in Logic IC Process Technology Accelerates
2.2 Capital Expenditures Remain Key Factor Affecting the Development of Logic IC Process Technology
2.3 Hybrid Technology to Accelerate Process Technology Improvement
2.4 Rising Capital Expenditures for High-end Orders
MIC Perspective
Appendix
Glossary of Terms
List of Companies

 

LIST OF FIGURES

Figure 1 Mass Production Schedule for Major Logic IC Process Technologies
Figure 2 Major Chipmakers' Expected Capital Expenditures in 2013

 
Date of Publication:
Jun 19, 2013
File Format:
PDF via E-mail
Number of Pages:
7 Pages
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