Conventional Assembly Defects Photo Album

Conventional Assembly Defects Photo Album

Electronic Presentation Services, Date of Publication: Dec 27, 2012
US$165.00
BW-PHA12

The defect and photo album provides a collection of the most common process defects for use in inspection standards, posters, training manuals and technical articles. Each file is stored on the CD in a tiff file format. Just think of the process defects and they will be on the disk.

Conventional Assembly Defects Photo Album Listing

1 Cored Solder Wire
2 Historical Soldering Iron
3 Lifted PCB Pads
4 Leaching of Hybrid Metallisation
5 Poor Tin /Lead Pad Wetting
6 Poor Hole to Lead Ratio
7 Microsection of poor PTH Knee Wetting
8 Microsection PTH Knee Damage
9 Solder Resist in Plated Through Hole
10 Microsection of Multilayer Track Separation
11 Poor Adhesion of Solder Mask
12 Microsection of Multilayer Resin Smear
13 Poor Gold Plate Adhesion
14 Microsection of Poor PTH Solderability
15 Marking Legend Ink Pad Contamination
16 Poor PTH Copper Plating
17 Marking Legend Ink Pad Contamination
18 De-wetting of tin/lead pads
19 De-wetting of tin/lead pads
20 Via Hole Pad Breakout
21 Uneven Tin/Lead Plating on Pads
22 Microsection of Satisfactory Solder Levelled Pad
23 Microsection of Satisfactory Plated Through Hole
24 Solder Resist Failure on PCB Track
25 Microsection of PTH Copper Failure
26 Microsection of Pad Plating
27 Solder Resist in Plated Through Hole
28 Bulbous Solder Fillets
29 Poor Through Hole Solder Rise
30 Poor Component Lead Solderability
31 Non Wetting of Lead
32 Pin Hole/Blow Hole In Solder Joint
33 Solder Short
34 Solder Spikes
35 Solder Mask Lifting
36 Poor Soldering on Flexible Circuit Pads
37 Pin Hole/Blow Hole In Solder Joint
38 Satisfactory Component Lead Length
39 Satisfactory Lead Clinch
40 Wave Soldering Solder Balls
41 Wave Soldering Solder Balls
42 Close Up of Solder Ball
43 Minor Solder Spikes
44 Cracked Through Hole Joint
45 Uneven Lead Length
46 Lifted Integrated Circuit Leads
47 Single Sided Board Assembly Top View
48 Wire Insulation in Solder Joint
49 Microsection of Poor PTH Solderability
50 Poor Pad Solderability
51 Poor Pad Solderability
52 PCB Topside Solder Short
53 Poor Topside Solder Fillets
54 Microsection of Poor Topside Solder Fillets
55 No Topside Solder Fillets
56 Cracked Solder Fillet
57 Poor Topside Fillet Due to Heat Loss
58 Incomplete Solder Fillet
59 Microsection of Poor Lead Cutting
60 Through Hole Component Lift
61 Poor Topside Solder Fillets
62 Poor Topside Solder Fillets
63 Microsection of Poor Lead Cutting
64 Corner Pin Contamination in Solder Joints
65 Poor Topside Fillets
66 Incomplete Solder Fillet
67 Poor Pin Solderability
68 Satisfactory Topside Fillet
69 Solder Pick Up on Tracking Due to Resist Failure
70 Solder Pick Up on Tracking Due to Resist Failure
71 Satisfactory Lead Clinch
72 Dross Solder Short
73 Poor Topside Solder Fillets
74 Microsection of Solder Joint Cracking
75 Inconsistent Topside Fillets
76 Sunken Solder Fillets Due to Outgassing
77 Solder Short
78 Broken Component Lead
79 Poor Tin/Lead Pad Solderability
80 Inconsistent Hand Solder Joints
81 Cracked Solder Joint
82 Pin Hole In Solder Joint
83 Solder Resist Wrinkle
84 Incomplete Topside Fillets
85 Component Resin Joint Contamination
86 PCB Pad Burring
87 Solder Sliver on Joint
88 Poor Lead Trimming
89 Poor Lead Trimming
90 Bulbous Solder Joint
91 Lifted Single Side Solder Pad
92 Solder Joint Crack
93 Satisfactory Solder Joint
94 Solder Ball on PCB
95 Solder Short on PGA
96 Solder Ball Attached to Track
97 Satisfactory Clinched Solder Joints
98 Satisfactory Solder Joint with Resist on Pads
99 Incomplete Solder Joint
100 Solder Shorts
101 Poor Topside Solder Fillets
102 Damage to PTH Plating
103 No Topside Solder Fillet
104 Poor Topside Solder Fillets
105 Multiple Solder Shorts
106 Solder Mask Lifting Due to Tin/Lead Under Resist
107 Satisfactory Solder Joint on Wire and Pin Termination
108 Satisfactory Topside Solder Fillets
109 Satisfactory Solder Fillets
110 Un Soldered Via Holes
111 Satisfactory Solder Joints
112 Satisfactory Solder Joint
113 Flux Residues on PCB
114 Flux Residues after Hand Soldering
115 Flux Corrosion Topside Of PCB
116 Dendrite Corrosion on PCB
117 Dendrite Corrosion Across Resist
118 Dendrite Corrosion Under and Over Resist
119 Cleaning Attack on Component Coating
120 Verdigree Corrosion From Copper
121 Flux Trapped Under Component
122 Component Glass Seal Cracking
123 Microsection of Non Wetting on Component Lead
124 Poor Solderability on Brass Terminations
125 Component Glass Seal Cracking
126 De-Wetting on Component Lead
127 Poor Lead Plating on Component
128 Poor Lead Plating on Component
129 De-Wetting on Component Lead
130 De-Wetting on Component Lead
131 Excess solder on dual in line terminations
132 Outgassing from through hole joints
133 PCB sag during wave soldering
134 Lifted through hole component
135 Doss short after wave soldering
136 Solder whisker left on joint
137 Incomplete joint due to insulation in joint
138 Solder flags on long terminations after wave soldering
139 Incomplete solder joint after wave soldering
140 Corrosion under the solder resist due to flux contamination
141 Solder balls after wave soldering
142 Damage to through hole component lead during insertion
143 Solder shorts on connector pins
144 Skipped pads during wave soldering
145 Poor through hole fill in microsection
146 Microsection of through hole parts with poor hole fill
147 Poor through hole fill in plated through holes
148 Poor through hole filling in plated through holes
149 Poor through hole filling in plated through holes
150 Poor through hole filling in plated through holes
151 Microsection of through hole parts with poor hole fill
152 Poor through hole filling in plated through holes
153 Excessive coating drainage on through hole pins
154 Coating contaminating joint areas
155 Through holes prior to repair
156 Drilling out holes prior to repair
157 Insertion of copper repair bails
158 Insertion of copper repair bails
159 Compression of copper bails in hole
160 Compressed bail in hole
161 Comparison of bail and funnelet
162 Repair foils for track repair
163 Foil preparation for soldering or bonding
164 Positioning of copper repair lands with Kapton tape
165 Copper foil on Kapton tape
166 Copper foil on Kapton tape
167 Copper foil on Kapton tape
168 Repair foils for track repair
169 damage to board during modification
170 Damaged track and through hole pad
171 Scratching of resist during track repair
172 Cutting track during board repair
173 Copper plated through hole barrel on component lead
174 Microsection of single sided joint failure
175 Cracking in single sided joint
176 Extended through hole pads to aid drainage
177 Drainage pads on QFP
178 Boding link wires to PCB
179 Conventional component using vacuum hold down
180 Outgassing in a plated through hole
181 Conventional component using vacuum hold down
182 Defective stranded wire termination to contact
183 Incomplete joint with wire in through hole
184 Paste on pad surface
185 Paste on pad surface
186 Poly balls used in foam fluxer
187 Defective wire termination to contact
188 Microsection of void in PTH
189 Example of joints on coil bobbin
190 Flux corrosion on connector contacts
191 Flux residues left on PCB after hand soldering
192 Dendrite growth on the surface of the PCB
193 As above
194 Copper corrosion deposits
195 Warped PCB assembly
196 Copper burr on single sided board
197 Cracked single sided joint after pin removal
198 Cracked single sided joint after pin removal
199 Cracked single sided joint after pin removal
200 Cracked single sided joint after pin removal
201 SEM of wire failure in dual in line relay due to flux corrosion
202 SEM of wire failure in dual in line relay due to flux
203 Incomplete solder joints, the hole size is too big
204 Solder flood
205 Flux and tape contamination
206 Flux and tape contamination
207 As above
208 As above
209 AS above
210 As above
211 As above
212 Flux residues through via holes
213 Flux residues on PCB surface
214 Gold edge connector contamination
215 As above
216 Adhesive contamination on edge connector
217 As above
218 As above
219 Resin contamination on pin
220 Resin contamination in joint
221 As above
222 As above
223 As above
224 As above
225 As above
226 Poor solder penetration
227 Poor solder penetration
228 As above
229 AS above
230 Solder skip due to jig design
231 Section of tin/copper intermetalic
232 Solder dross in air
233 Solder dross in air
234 Solder dross on wave plus tin oxides
235 As above
236 IC with no damage
237 Static damage to IC above
238 Static damage to IC SEM view
239 Static damage to IC SEM view
240 Static damage to IC SEM view
241 Static damage to IC SEM view
242 Handling IC no lead contact
243 Handling IC lead contact

Date of Publication:
Dec 27, 2012
File Format:
CD-ROM
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