IPC-7093 Design and Assembly Process Implementation for Bottom Termination Components

IPC-7093 Design and Assembly Process Implementation for Bottom Termination Components

Date of Publication: Mar 1, 2011, 68 Pages
US$152.00
IPC-7093

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process.

Date of Publication:
Mar 1, 2011
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
68 Pages
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