Economics and Cost Modeling

Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.

Date of Publication: Jan 11, 2016

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The 2016 revision 00 adds 10nm processes and includes a number of other improvements and updates.

Date of Publication: Oct 28, 2015
The MEMS Cost and Price Model is designed to easily calculate the manufacturing cost and selling price of most MEMS products. The model supports up to two MEMS die and up to two IC die in the same package with packaging and test costs. The model forward forecasts out to 2020. 100mm to 200mm wafer sizes are supported. Wafer fabrication, test and packaging costs are all covered. The price includes twelve months of upgrades with phone and email support.

Date of Publication: Sep 24, 2015
The Discrete and Power Products Cost and Price Model - new revision has now been released with new processes and other enhancements. Easily calculate the cost and price of high power silicon ICs and discrete devices with only 5 required selections/entries. The model supports over 260 processes and over 70 package types. All of our models include twelve month of updates with reasonable email and phone support.

Date of Publication: Sep 24, 2015

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments (DRAM, Foundry, IDM Logic and NAND) and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out over the next decade (out to 5nm logic and 12nm memory plus 3D). The model provides detailed process, equipment and materials details and all values are user editable for custom calculations. All of our models include twelve month of updates with reasonable email and phone support.

Date of Publication: Apr 7, 2015
Modeling Simulation and Design Tools The Modeling Simulation and Design Tools - 2015 iNEMI Roadmap is the most comprehensive roadmap published to date by...

Date of Publication: May 7, 2014
This report provides a detailed analysis of the fab and manufacturing implications of 3D floating gate and charge trap NAND concepts from Samsung, Toshiba, SK Hynix and Intel-Micron versus 16nm 2D NAND.  The analysis is based on a bottoms-up process flow analysis for each 3D NAND technology and 16nm 2D NAND.