Economics and Cost Modeling

US$2,300.00
Date of Publication: Sep 12, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

US$2,300.00
Date of Publication: Sep 12, 2018

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


US$5,000.00
Date of Publication: Sep 12, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.


US$1,995.00
Date of Publication: Sep 12, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

US$1,200.00
Date of Publication: Sep 12, 2018

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.


US$2,750.00
Date of Publication: Apr 19, 2016
This new report addresses the global cost of goods sold and industry wide operating profit for the worldwide capacitor industry by type, including ceramic, aluminum, tantalum and plastic film. The study addresses fixed and variable costs associated with the production of capacitors, with emphasis upon variable raw material costs, variable labor charges, variable overhead and manufacturing costs and the trend that is occurring with respect to both the cost of goods sold and the overall operating profit for capacitors over time.

US$25,000.00
Date of Publication: May 7, 2014
This report provides a detailed analysis of the fab and manufacturing implications of 3D floating gate and charge trap NAND concepts from Samsung, Toshiba, SK Hynix and Intel-Micron versus 16nm 2D NAND.  The analysis is based on a bottoms-up process flow analysis for each 3D NAND technology and 16nm 2D NAND.  

US$3,995.00
Date of Publication: Jun 19, 2013
The global PV industry's recent past has seen wafer, cell, and module suppliers at the mercy of an inhospitable supply-demand imbalance throughout the global market. With supply consistently 200% of demand annually, c-Si module prices have fallen approximately 70% in two years. One positive externality of this cutthroat pricing is that manufacturing costs have fallen in line with pricing declines. This is mostly because pricing for key inputs further up the value chain has also fallen as a result of overcapacity and consequent margin evaporation.