Electronics Manufacturing

Date of Publication: May 29, 2015
Based on data from 158 PCB fabricators and assembly companies worldwide, this report presents data on the current state (2014) and the industry’s predictions for the data by 2019, collected for the 2015 IPC Technology Roadmap. The data are segmented by five applications: computer and telecommunications, consumer electronics, industrial and automotive, medical, and military and aerospace. Topics covered include clock speed, heat dissipation, operation cycles, environmental operating range, product life expectancy, lamination cycles, materials, board area, board thickness, layer count, embedded components, printed-in-place features, line width and spacing, via diameters, aspect ratios, surface-mount lands, I/O pitch, test density, recyclable content and component size, as well as numbers of vias, solder joints, and discrete, area array, peripheral leaded, peripheral leadless and through-hole components. Additional data that is not segmented by application covers voltage levels and optical channels.

Date of Publication: Jan 29, 2015
Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

Date of Publication: May 22, 2015
Lead-Free Electronics in Military & Aerospace Applications Based on data from 83 manufacturers supplying electronics to the military and aerospace...

Date of Publication: Sep 30, 2015
This Pivot Table covers quarterly revenue by region and product segment for all electronics manufacturing services (EMS) and original design manufacturing (ODM) companies in IDC's EMS database, from 1Q08 through 1Q15. This Pivot Table also provides updated market sizes for the two sectors of the EMS industry, the nine product segments for each sector, and the three regions for each sector.

Date of Publication: Aug 31, 2014
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This lates revision, IPC A-610F includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria.

Date of Publication: Sep 18, 2015
The Czech Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in the Czech Republic.

Date of Publication: Sep 17, 2015
Lower costs and its close proximity to Western Europe have made Central & Eastern Europe a preferred manufacturing location for a number of large global electronics companies. It is also becoming a preferred location for a significant number of medium-sized West European manufacturers. Volume 4 of the Yearbook of World Electronics Data provides production and market data on 12 countries within the region and is an essential guide to this strategically important low cost manufacturing location.