Electronics Manufacturing

Date of Publication: Nov 21, 2016
With the high market growth potential in India, a number of companies have rushed into it with an aim to tap into lucrative opportunities, including electronics brands and manufactures. With an expected GDP growth of 7.7% in 2017, India is one of the few countries still witnessing positive growth in the PC market. This report provides an overview of electronics manufacturers in India, covering raw material, component, EMS/sub-assemblies, and end-product manufacturers; pinpoints India's advantages in developing the electronics manufacturing industry; examines the development, the supply chain, and market opportunity of desktop PC and notebook PC in India from the standpoint of manufacturers and branded vendors.

Date of Publication: Nov 1, 2016
This IDC Presentation provides electronics manufacturing services (EMS) industry forecast from 2016 through 2021. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This Presentation also reviews the state of the industry and our core forecast scenario and assumptions. This forecast reflects historical data through CY 2Q16 and forecast estimates from 2016 through 2021.

Date of Publication: May 12, 2016
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This lates revision, IPC A-610F includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria.

Date of Publication: Oct 31, 2016
The global electrical enclosures market should reach $7.3 billion by 2021 from $5.0 billion in 2016 at a compound annual growth rate (CAGR) of 7.9%, from 2016 to 2021. The scope of this report is broad and covers different rules and regulations used globally in the manufacture and installation of different electrical enclosure types. The market is divided into electrical enclosure types by materials, means of production, market structure, location of installation, and by the application used in different industries and households. The market for electrical enclosures is also estimated by regional market by material type. Revenue forecasts from 2016 to 2021 are given for each estimate.

Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

Date of Publication: Jun 30, 2016

The global market for printed circuit boards (PCBs) reached nearly $61.5 billion in 2015. The market is expected to reach nearly $73.8 billion by 2021 from $63.5 billion in 2016, increasing at a compound annual growth rate (CAGR) of 3.1% from 2016 to 2021.

Date of Publication: Oct 24, 2016
In the report we identify 225 suppliers of the two common thermoplastic filaments for FFF printers – PLA (Polylactic Acid) and ABS (Acrylonitrile Butadiene Styrene). The growing numbers of third-party material suppliers if causing additional fragmentation of the 3D printing industry.  3D printer manufacturers such as Stratasys and 3D Systems have tried unsuccessfully to limit third-party suppliers, since they encroach on their own materials sold “with specificity” for their own 3D printers.