Electronics Manufacturing

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.

US$85.00
Date of Publication: Feb 2, 2012
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive...

US$152.00
Date of Publication: Aug 7, 1992
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of...

US$85.00
Date of Publication: Dec 17, 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure...

US$85.00
Date of Publication: Mar 2, 2006
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation...

US$4,650.00
Date of Publication: Dec 11, 2014
Graphene is an upcoming conducting material with the impending to substitute traditional electrode materials such as Indium tin oxide (ITO) in electrical and optical devices. Graphene is the strongest material ever found, it is harder than diamond and 300 times harder than steel, yet it is also stretchable like rubber and one of the thinnest materials in the world. This and several other features that make Graphene the most preferred material for applications such as extremely strong composite materials, flexible displays and nano-transistors and so on.

US$4,950.00
Date of Publication: Oct 13, 2014
Electronic Contract Manufacturing Services Market Analysis This report analyzes the worldwide markets for Electronic Contract Manufacturing Services in...