Electronics Manufacturing

Date of Publication: Jun 1, 2016
In the report we identify 225 suppliers of the two common thermoplastic filaments for FFF printers – PLA (Polylactic Acid) and ABS (Acrylonitrile Butadiene Styrene). The growing numbers of third-party material suppliers if causing additional fragmentation of the 3D printing industry.  3D printer manufacturers such as Stratasys and 3D Systems have tried unsuccessfully to limit third-party suppliers, since they encroach on their own materials sold “with specificity” for their own 3D printers.

Date of Publication: May 12, 2016
It takes a lot to be successful in electronics assembly: get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.

Date of Publication: Apr 14, 2016
This timely report provides a comprehensive overview of the major European EMS providers and will be of interest for companies across all areas of the electronics supply chain including industry analysts from the financial, management and government sectors. Covering the top 50 electronic manufacturing services (EMS) providers the report highlights not only the importance that the major "Global Tier 1" companies have in the region but also the key role the medium sized indigenous providers play in the Euro 25 billion European EMS market. The companies are ranked by revenue for 2014 with a profile provided for each company along with a listing of their European manufacturing facilities. For the seventh edition of the report a ranking of the Top 50 European-owned EMS providers based on global revenues is again provided.

Date of Publication: Apr 13, 2016
This report analyzes the worldwide markets for Selective Soldering in US$ Thousand. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. The global market for Selective Soldering Equipment is projected to reach US$63.5 million by 2022, driven by shrinking component size, rising component density and complexity, and growing investments in new generation semiconductor manufacturing equipment. The drive towards miniaturization of electronic components used mainly in telecom equipment and the increasing use of components that are temperature sensitive are being touted as key factors for growth of laser soldering. Simplified programming, flexible innovations, and better user interfaces are contributing towards the growth of selective soldering into a reliable replacement for custom pallets wave soldering and/or manual soldering.

Date of Publication: Apr 4, 2016

All the industrial electronics segments detailed till 2019 for every region in the world

  • Over 80 pages, of which 60 pages of production analysis (characteristics, trends & issues), and 20 of tables and graphs
  • Detailed world segment 2014 figures and 2014 - 2019 growth
  • Regional structure and forecasts 2014 - 2019 year by year for Europe, North America, Japan, China, Other Asia-Pacific, Rest of the World
  • Detailed analysis of over 30 product categories covering all industrial application markets

Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

Date of Publication: Mar 24, 2016
This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$ Million. The Global market is further analyzed by the following End-Use Markets: Automotive, Computers & Data Storage, Consumer Electronics, Defense & Aerospace, Displays, Mobile Phones, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2014 through 2020. The global market for Flexible Printed Circuit Boards is projected to reach US$15.2 billion by 2020, driven by the rising wave of electronic wearables and emerging new interest in foldable & rollable smartphones and polymer plastic solar cells. The market stands to benefit from the growing focus of manufacturers on design flexibility and performance.