Electronics Manufacturing

Date of Publication: May 13, 2013
Thermal Interface Material Market by Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Metallic TIMs, and PCM), by Application (Computers, Telecom, Medical Devices, Industrial Machinery, Consumer Durables, and Automotive Electronics), by Region - Trends & Forecasts to 2020. The Thermal Interface Material market size in terms of value is projected to grow at a CAGR of 11.0% between 2015 & 2020, and is estimated to increase to $962.0 Million by 2020. The market is segmented and values are projected on the basis of key regions, such as North America, Europe, APAC, and RoW (Rest of the World). The leading countries are covered and projected for each region. Further, the market is segmented and values are estimated on the basis of different types and applications.

Date of Publication: May 11, 2015
Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application...

Date of Publication: Jul 21, 2015
The 3D metrology is a dimensional analysis method used to measure an object and acquires all surface points of an object including the hidden points such as non-accessible undercuts. This technology is used in the quality control process to ensure the accuracy of manufactured products. 3D metrology is widely being used in automotive, aerospace, energy & power, and other sectors. This report segments the said market based on product, application, and geography. The report also includes the analyses and forecasts related to the 3D metrology market.

Date of Publication: Aug 6, 2015
The report gives an overview of the major geographic regions in the e-waste management market such as the Americas, Europe, Asia-Pacific (APAC), and the Rest of the World (RoW). The report discusses about the recent happenings in the market and the impact analysis of the market dynamics. This report focuses on providing a detailed segmentation of the e-waste management market, combined with the qualitative and quantitative analysis of each and every aspect of the classification, on the basis of the controlling component, application, and geography. All the numbers at every level of detail are estimated till 2020 to give a glimpse of the potential market size in terms of value and volume of the material recovered in this market.

Date of Publication: Mar 25, 2015
This update provides IDC's electronics manufacturing services (EMS) industry forecast from 2014 through 2019. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. The update also reviews the state of the industry and our core forecast scenario and assumptions. This forecast reflects historical data through CY 3Q14 and forecast estimates from 2014 through 2019

Date of Publication: Jul 24, 2015
This report provides an overview of the global markets for electronics contract manufacturing services; Analyses of global market trends, with estimates for 2015 and 2016, and projections of compound annual growth rates (CAGRs) through 2021;  Discussion covering electronics contract manufacturing services operations which may include designing, manufacturing, testing, distributing, and providing repair services for electronic assemblies required by original equipment manufacturers (OEMs).

Date of Publication: Jul 6, 2015
South Korea on the back of its leading position in semiconductors, mobile communications and advanced consumer electronic products is the fourth largest electronics producer globally with output of US$117.2 billion in 2014.  After declining by 3.4% in 2012 electronics production rebounded in 2013 increasing by 8.9% on the back of strong growth in both the semiconductor and wireless communications segments. Growth eased in 2014 but still posted healthy growth estimated at 5.3% for the year as a whole with the main drivers again the semiconductor and wireless communications segments. For 2015, growth is expected to be more subdued at 1.6% as demand in the key semiconductor segment slows.