Electronics Manufacturing

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Wireless OEM Fronthaul Optical Transceiver (OTRX) Module Supplier Analysis,
Wireless OEM Fronthaul Optical Transceiver (OTRX) Module Supplier Analysis, 2015-2016 Shipments
US$5,775.00
Date of Publication: Feb 5, 2018
This report provides a comprehensive analysis of shipments for fronthaul optical transceiver small form factor (SFP) pluggable modules by the major wireless OEM network equipment vendors. A detailed analysis of OTRX module shipments by data rate, module type, and transmission mode for 2015-2016 is presented for each wireless OEM. The report also contains a complete supplier directory of OTRX modules available by each wireless OEM
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Development of the Indian ESDM (Electronics System Design and Manufacturing) Industry
Development of the Indian ESDM (Electronics System Design and Manufacturing) Industry
US$600.00
Date of Publication: Nov 17, 2017
This report provides an introduction into the development of the ESDM industry and market across different areas and segments such as mobile phone, TV, STB (Set Top Box), LED lighting, automotive electronics, and power sector/renewable energy; examines the government policies proposed for the ESDM development and promotion with an aim to identify business opportunities for electronics companies intending and willing to invest in India.
Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
Thermal Management Technologies for Semiconductor Microchips
US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.
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IPC-6010-FAM, Printed Board Performance Specifications
IPC-6010-FAM, Printed Board Performance Specifications
US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.

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IPC 7090-FAM: Packages for PCBs and Assemblies
IPC-7090-FAM: Packages for PCBs and Assemblies
US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.
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IPC-BdMATFAM
BdMATFAM: Base Materials Specifications for Printed Boards
US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.
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IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
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