IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry

Study of Quality Benchmarks for Electronics Assembly 2018

IPC, Date of Publication: Jul 11, 2018, 152 Pages
US$1,350.00
BMK-MR-0-DG-E-EN-18

The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.

The quality control measurements covered by the study include yields for various test methods as well as the percentages of products subjected to these tests. Yields and defect rates at first pass and final inspection, internal yields of key processes, defect rates, and DPMO and yield targets, and the average cost of poor quality as percentages of sales for rework and scrap are also covered. The study reports on the use of various quality control methods.

Customer satisfaction and supplier performance measurements are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, finished end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors.

The aggregate data represent 63 electronics assembly companies of all sizes – both OEMs and contract electronics manufacturers – in all regions of the world.

Study of Quality Benchmarks for Electronics Assembly 2018
TABLE OF CONTENTS

Introduction

About the Study, Using the Study and Definition of Metrics
Respondent Demographics

Summary of Key Findings

Detailed Results

All Companies

By Company Size
Companies with Less Than $10 Million in Sales
Companies with $10 Million t- $24 Million in Sales
Companies $25 Million t- $99 Million in Sales
Companies $100 Million or More in Sales

By Region
Americas
Europe
Asia

By Type of Production
Rigid Printed Board Assembly
End Product
Mechanical Assembly
Flexible Circuit & Rigid Flex Assembly
Cable & Harness (Multiple Wires)
Discrete Wiring Terminals & Connectors
Rigid Back Plane

Appendices

Survey Questionnaire
Current Studies

Production

• Number of printed circuit assemblies (PCAs) completed during the last calendar year
• Total components placed during the last calendar year
• Percentage of components placed that were:
- SMT
- PTH
• Inventory accuracy as a percentage of components on hand:
- SMT components
- PTH components
• Product types produced (percent of responding companies)

Quality Control

• Percentage of products utilizing electrical assembly test method:
- In-Circuit Test (ICT)
- Manufacturing Defects Analyzer (MDA)
- Flying Probe
- Boundary Scan
• Average first-pass yield:
- In-Circuit Test (ICT)
- Manufacturing Defects Analyzer (MDA)
- Flying Probe
- Boundary Scan
• % of products utilizing automated optical inspection (AOI)
• % of products utilizing automated x-ray inspection (AXI)
• % of products that have final functional test
• First pass yield at final functional test
• Defect rate in defects per million opportunities (DPMO) at testing
• Average yield at final inspection
• Average first pass yield at final inspection
• Defect rate in defects per million opportunities (DPMO) at final inspection
• Facility’s DPM- or yield targets:
- Yield
- DPMO
• Internal yields of key processes:
- Surface Mount
- Wave Solder
- Selective Solder
• Average cost of poor quality (COPQ) t- gross sales:
- Rework
- Scrap
- Labor time for board assemblies requiring touch-up after wave soldering
• Test methods in use (percent of responding companies
• Quality control methods in use (percent of responding companies)
• Frequency with which companies evaluate SPC control limits

Customer Satisfaction

• Measurement system in place t- assess the customer satisfaction (percent of responding companies)
• Rate of customer returns in parts per million (PPM):
- PCB assemblies
- System build item
• Percentage of RMA returns during the last calendar year
• Percent of printed circuit assemblies (PCAs) shipped “dock-to-stock”
• Average rate of on-time customer deliveries during the last calendar year
• Rate of customer-returned items that failed:
- Zer- KM (Infant mortality, dead on arrival)
- Within 1-year warranty
- After 1 year

Supplier Performance
• Track supplier performance (percent of responding companies)
• Percent of on-time deliveries from PCB suppliers
• Percent of on-time deliveries from component suppliers
• Lot reject rate

Certification

Percent of responding companies that have received, are in process of obtaining, and have no plans to
obtain the following certifications:

• IS- 9001
• IS- 14001
• AS 9100
• QS 9000
• TS16949
• TL 9000
• QS- 80000
• FDA 820 Registration
• IS- 13485
• ITAR

 

Date of Publication:
Jul 11, 2018
File Format:
PDF
Number of Pages:
152 Pages