Equipment and Materials

US$4,995.00
Date of Publication: Feb 10, 2017

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.


US$6,650.00
Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.

US$2,495.00
Date of Publication: Jan 7, 2017
Chemicals and materials are used in every processing step in the fabrication of silicon and gallium arsenide integrated circuits. Technological advances in Si and GaAs ICs have resulted in more stringent requirements in the purity and quality of processing chemicals and materials for cleaning, etching, and deposition. As linewidths decrease, the level and size of contaminants in both chemicals and the manufacturing cleanroom become increasingly important as it directly impacts device yield. This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented.

US$2,495.00
Date of Publication: Jan 7, 2017

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,495.00
Date of Publication: Jan 7, 2017
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

US$2,495.00
Date of Publication: Jan 7, 2017
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

US$2,495.00
Date of Publication: Jan 7, 2017

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.