Flip Chip Assembly Photo Album

Flip Chip Assembly Photo Album

Date of Publication: Aug 15, 2013
US$165.00
BW-PHA9

Solve your flip chip assembly problems and printed circuit board defects. This photo album provides a collection of the most common process defects for use in inspection standards, posters, training manuals and technical articles.

Flip Chip Assembly Photo Album Includes:

01 Die mounted on tape in feeder
02 Close up of sawn wafer on sticky tape back view
03 Close up of sawn wafer on sticky tape back view
04 Close up of sawn die
05 Close up of wafer with bad die marks
06 Wafer with bad die marks
07 Wafer with bad die marks
08 Close up of wafer with bad die marks
09 Wafer with bad die marks
10 View of wafer on sticky tape
11 Wafer on stick tape and mounting plate
12 Flip chip tape feeder
13 Flip chip tape feeder
14 Flip chip tape feeder
15 Flip chip tape feeder with die
16 Flip chip tape feeder with die
17 Flip chip tape feeder with die
18 Die being fluxed
19 Fluxing plate
20 Die on pickup tool
21 Die on pickup tool
22 Die pickup
23 Underfilled die on ceramic board
24 Underfilled die on ceramic board
25 Flip chip on ceramic board
26 Flip chip on ceramic board
27 Flip chip on ceramic board
28 Flip chip on ceramic board
29 Flip chip on ceramic board
32 Die feeding on sticky tape
33 Die in tape and reel pocket
34 Die in tape and reel pocket
35 Die in tape and reel pocket
36 Die prior to placement
37 Die prior to placement
38 Die prior to placement
39 Die being fluxed
40 Die being fluxed
41 Die being fluxed
42 Die being fluxed
43 Die prior to fluxing
44 Die on sticky tape
45 Glass die underfill demo board
46 Glass die on demo board
47 Die on sticky tape
48 Die in waffle tray
49 Die in waffle tray
50 Test die on waffle tray
51 Test die on waffle tray
52 Bumps on edge of die
53 Minimal edge damage to die
54 Edge damage to die
55 Edge damage to die
56 Close up of Siemens die
57 Close up of Siemens die
58 Close up of die on tape
59 Close up of die on tape
60 Die on tape and reel sticky tape
61 Die on tape and reel sticky tape
62 Close up of bump site
63 Bump site on die
64 Bump site on die
65 Incorrect clearance of resist to bond pads
66 Close up of die edge
67 Contamination on die surface
68 Contamination of die surface
69 Close up of bump site
70 Incorrect clearance of resist to bond pads
71 Close up of bump site
72 Resist on bond pads
73 Resist on bond pads
74 Close up of bond pads on PCB
75 Example of Siemens bumped die
76 Close up of Siemens bumped die
77 Close up of Siemens bumps
78 Close up of bump location
79 Example of bumped die
80 Example of bumped die
81 Close up of bumped die
82 Close up of bumped die
83 Close up of bumped test die
84 Glass die after underfill operation
85 Glass die after underfill operation
86 Under fill operation showing touch probe
87 Wafer
88 COB Music Board
89 Wire Bond Testing
90 Siemen's Flip Chip Board
91 Siemen's Flip Chip Close Up
92 Siemen's Flip Chip Board
93 CSP on a phone board
94 CSP on a phone board
95 CSP on a phone board
96 Flip Chip and Underfill
97 CSP on a phone board
98 Trial Paste Deposits for flip chip boards
99 Trial Paste Deposits for flip chip boards
100 Trial Paste Deposits for flip chip boards
101 Trial Paste Deposits for flip chip boards
102 Trial Paste Deposits for flip chip boards
103 Trial Paste Deposits for flip chip boards
104 Underfill on glass die
105 Underfill on glass die
106 Underfill on glass die
107
108 Flip Chip Paste Print Test Prints close up
109 Flip Chip Paste Print Test Prints close up
110 Flip Chip Paste Print Test Prints
111 Flip Chip multi board
112 Chip on board test board
113 Die and underfill
114 Close up of die bumps
115 Test board pad site
116 Test board pad pattern
117 As above
118 Glass Fiber Test Die Poor Scoring
119 Glass Fiber Test Die Poor Scoring
120 Glass Fiber Test Die Poor Scoring
121 Glass Fiber Test Die Poor Uneven Scoring
122 Flip Chip Paste Print Test Prints close up
123
124 Flip Chip Paste Print Test Prints close up
125 Flip Chip Paste Print Test Prints close up
126 Flip Chip Paste Print Test Prints close up
127 Flip Chip Paste Print Test Prints close up
128 Flip Chip Paste Print Test Prints close up
129 Flip Chip Paste Print Test Prints close up
130 Flip Chip Paste Print Test Prints close up
131 Flip Chip Paste Print Test Prints close up
132 Flip Chip Print Stencil Apertures
133 Flip Chip Print Stencil Apertures
134 Flip Chip Print Stencil Apertures
135 Flip Chip Print Stencil Apertures
136 Flip Chip Print Stencil Apertures
137 Flip Chip Print Stencil Apertures
138 No Flow Underfill after Reflow
139 No Flow Underfill after Reflow
140 No Flow Underfill after Reflow on Copper Sheet
141 Screen printing Flip Chip Dummy Die
142 Screen printing Flip Chip Dummy Die
143 Reflow of Dummy Flip Chips
144 Screen printing Flip Chip Dummy Die
145 Reflow of Dummy Flip Chips
146 Reflow of Dummy Flip Chips
147 Reflow of Dummy Flip Chips
148 Flip Chip Dummy Panel
149 No Flow Underfill after CSP Reflow
150 No Flow Underfill after CSP Reflow
151 Flip Chip after Soldering with Corner Mark
152 Flip Chip after Soldering with Corner Mark
153 Flip Chip after Soldering with Corner Mark
154 Laminate Flip Chip after Soldering with Corner Mark
155 Laminate Flip Chip after Soldering with Corner Mark
156 Flip Chip after Soldering with Corner Mark
157 Laminate Flip Chip after Soldering with Corner Mark
158 CSP Reflowed with No flow Underfill
159
160 Flip Chip Reflowed with No flow Underfill
161 CSP Reflowed with No flow Underfill
162 Glass die with minimum underfill
163 Glass die with large void due to poor dispense profile
164 Close up of above
165 Close up of above
166 Close up of above
167 Close up of above
168 Close up of above
169 Glass die with underfill
170 Fiberglass dummy flip chip
171 CSP with excessive underfill
172 As above
173 CSP with underfill
174 CSP with excessive underfill
175 CSP with underfill
176 CSP with excessive underfill
177 CSP with underfill
178 CSP with underfill
179 CSP with excess underfill
180 Fiberglass dummy flip chip with underfill
181 As above
182 As above
183 As above
184 Dummy fiberglass BGA with underfill
185 Dummy fiberglass BGA with underfill
186 Dummy fiberglass BGA with underfill
187 Dummy fiberglass BGA with underfill
188 Glass die with underfill
189 Fiberglass dummy flip chip with underfill


X-Ray Images

01 Flip chip after reflow x ray view
02 Close up of solder short on flip chip
03 Close up of two termination point on flip chip
04 As above
05 Flip chip after reflow with corner alignment marks
06 As above
07 Close up of two termination points with voids
08 As above with solder ball
09 Flip chip after reflow x ray view
10 Close up of Flip Chip Joints
11 Reflowed joints showing wetting along track
12 X-Ray of CSP
13 X-Ray of CSP Slight Displacement
14 X-Ray of Misplaced CSP with Open Joints
15 X-Ray of CSP
16 X-Ray of BGA
17 X-Ray of CSP with Voiding
18 X-Ray of BGA Close up of Joints
19 Laminate x-ray of Joints and Shorts
20 Close up Laminate x-ray of Joints and Shorts
21 Close up Laminate x-ray of Joints and Shorts
22 Collapsed Joints on Laminate Flip Chip
23 Close up Laminate x-ray of Joints and Shorts
24 Close up Laminate x-ray of Joints
25 Close up Laminate x-ray of Joints and Shorts
26 Close up Laminate x-ray of Joints and Shorts
27 CSP Close up Laminate x-ray of Joints and Shorts
28 Close up Laminate x-ray of Joints and Shorts
29 Close up Laminate BGA x-ray of Joints and Shorts
30 Close up Laminate BGA x-ray of Joints and Shorts
31 Close up Laminate BGA x-ray of Joints and Shorts
32 Laminate BGA x-ray of Joints and Shorts
33 Close up Laminate x-ray of Joints and Shorts
34 Variation of Flip Chip Joints
35 Variation of Flip Chip Joints
36 Variation of Flip Chip Joints
37 Flip Chip Joints
38 Flip chips shorts
39 Satisfactory/Open joints
40 Misplaced flip chip
41 As above
42 Misplaced flip chip with joints
43 As above
44 Satisfactory/Open joints
45 Satisfactory/Open joints

Date of Publication:
Aug 15, 2013
File Format:
CD-ROM
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