Global Semiconductor Silicon Wafer Market

Global Semiconductor Silicon Wafer Market

BCC, Date of Publication: Nov 20, 2019, 163 Pages
US$2,750.00
GB-SMC112A

The global market for semiconductor wafers should grow from $16.2 billion in 2018 to $21.3 billion by 2023 with a compound annual growth rate (CAGR) of 5.7% for the period of 2018-2023.

Americas semiconductor wafers market should grow from $4.5 billion in 2018 to $5.8 billion by 2023 with a compound annual growth rate (CAGR) of 5.4% for the period of 2018-2023.

EMEA semiconductor wafers market should grow from $4.0 billion in 2018 to $5.1 billion by 2023 with a compound annual growth rate (CAGR) of 5.0% for the period of 2018-2023.

Report Scope

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses -

  • Telecommunications.
  • Instrumentation and scientific research.
  • Healthcare.
  • Energy, defense and surveillance.
  • Computing and entertainment.
  • Industrial and automotive.
  • Retail and others.

Each of the end applications is further broken down by crystal growth methods -

  • Bridgman and allied methods (Bridgman).
  • Float-zone (FZ).
  • Czochralski (CZ) and allied methods (Czochralski).

Each end application is broken down by the following wafer-bonding methods -

  • Direct bonding.
  • Surface-activated bonding.
  • Anodic bonding.
  • Plasma bonding.

Each end application is further broken down by node size -

  • 10 nm and lower.
  • 12 to 22 nm.
  • 28 nm and above.

Each end-application is further broken down by regional market -

  • Americas.
  • Europe, Middle East and Africa (EMEA).
  • Asia Pacific (APAC).

Report Includes:

  • 72 data tables and 10 additional tables
  • An overview of the global markets for semiconductor silicon wafers
  • Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
  • Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
  • Coverage of major innovation initiatives in silicon wafer fabrication technology
  • Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc

Global Semiconductor Silicon Wafer Market
TABLE OF CONTENTS

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing the Study
  • Scope of the Report
  • Intended Audience
  • Methodology and Information Sources
  • Geographic Breakdown
  • Analyst's Credentials

Chapter 2: Executive Summary

Chapter 3: Semiconductor Device Manufacturing and Material Properties

  • Steps in Semiconductor Device Manufacturing
    • Wafering
    • Fabrication
    • Packaging
  • Silicon (Si)
    • Silicon and the Periodic Table
    • The Carbon Family
    • Silicon
  • Compound Semiconductors
    • Gallium Arsenide (GaAs)
    • Indium Phosphide (InP)
    • Gallium Nitride (GaN)
    • Group II-VI: Oxides, Sulfides, Selenides and Tellurides
    • Group IV: Silicon-Based Compounds and Alloys
  • Gate Definition Methodology
    • Transistor-Transistor Logic (TTL)
    • Complementary Metal Oxide Semiconductor (CMOS)
    • Field Effect Transistor (FET)
    • Metal Oxide/Insulator Semiconductor Field Effect Transistor (MISFET/MOSFET)
    • Bipolar CMOS (BiCMOS)
    • Metal Semiconductor Field Effect Transistor (MESFET)
    • High Electron Mobility Transistor (HEMT)
    • Hetero-Junction Bipolar Transistor (HBT)
  • Wafer Sizing
    • The 450 mm Wafer Challenge

Chapter 4: Crystal Growth Methods

  • Introduction
  • Czochralski (CZ) and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Bridgman-Stockbarger and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Float Zone (FZ) and Allied Methods
    • Methodology
    • Key Vendors and Innovations
  • Market Overview
  • Post-Crystal Growth Wafer Processing
    • Ingot Formation, Grinding and Trimming
    • Wafer Slicing and Rounding
    • Lapping

Chapter 5: Wafer-Bonding Process

  • Direct Bonding
    • Methodology
    • Advantages
  • Surface-Activated Bonding (SAB)
    • Methodology
    • Advantages
  • Plasma-Activated Bonding (PAB)
    • Methodology
    • Advantages
  • Anodic Bonding
    • Methodology
    • Advantages
  • Market Overview

Chapter 6: Node Sizes

  • Introduction
  • Overview of the Etching Process
    • Equipment Involved
    • Process Challenges
  • Moore's Law
  • 10 nm and Less
    • Architecture
    • Key Developments
  • 12 nm to 22 nm
    • Architecture
    • Key Developments
  • 28 nm and More
    • Architecture
    • Key Developments
  • Market Overview

Chapter 7: Regional Markets

  • Americas
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • EMEA
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • APAC
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • Market Overview

Chapter 8: Global Markets

  • Telecommunications
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Instrumentation and Scientific Research
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Healthcare
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Energy, Defense and Surveillance
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Computing and Entertainment
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Industrial and Automotive
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Retail and Others
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market

Chapter 9: Patent Analysis

  • Introduction
  • Breakdown by Category
  • Breakdown by Year
  • Breakdown by Country
  • Profile of Assignees

Chapter 10: Company Profiles

  • Wafer Manufacturing and Processing Equipment Vendors
    • Pricing Dynamics
    • Key Companies
    • Semiconductor Material Suppliers
    • Pricing Dynamics
    • Key Companies
  • Additive Materials Suppliers
    • Pricing Dynamics
    • Key Companies
  • Wafer Manufacturers
    • Pricing Dynamics
    • Key Companies
  • Foundries and Semiconductor Device Designers
    • Pricing Dynamics
    • Key Companies
  • Companies
    • 3M
    • II-VI EPIWORKS
    • AIXTRON
    • APPLIED MATERIALS
    • ALINEASON
    • BREWER SCIENCE INC.
    • CMK SRO
    • DISCO CORP.
    • ELECTRONICS AND MATERIALS CORP. LTD (E&M)
    • ELKEM
    • EV GROUP
    • GLOBALWAFERS JAPAN CO. LTD.
    • HEMLOCK SEMICONDUCTOR CORP.
    • KOKUSAI ELECTRIC
    • INTEL
    • LINTEC CORP.
    • MECHATRONIK SYSTEMTECHNIK GMBH
    • MICRON
    • NICHIA CORP.
    • NISSAN CHEMICAL CORP.
    • OKMETIC
    • POWERCHIP
    • SAMSUNG
    • SHANGHAI SIMGUI TECHNOLOGY
    • SHIN-ETSU CHEMICAL CO. LTD.
    • SILTRONIX SILICON TECHNOLOGIES
    • SILICON MATERIALS INC.
    • SILICON VALLEY MICROELECTRONICS
    • SILTRONIC AG
    • SK HYNIX
    • SK SILTRON
    • SOITEC
    • SUMCO CORP.
    • SUSS MICRO TEC AG
    • SYNOVA
    • THERMCRAFT
    • TOKUYAMA CORP.
    • TOSHIBA
    • TSMC
    • ULVAC INC.
    • UMC
    • VIRGINIA SEMICONDUCTOR
    • WACKER CHEMIE AG
    • WAFER WORKS CORP.
    • WAFER WORLD INC

List of Tables

Summary Table: Global Market for Semiconductor Wafers, Through 2023
Table 1: Physical Properties of the Main Compound Semiconductor Materials Compared to Silicon
Table 2: Group III-V Compound Semiconductors, by Chemical Composition
Table 3: Group II-VI Compound Semiconductors, by Chemical Composition
Table 4: Group IV Compound Semiconductors
Table 5: Other Compounds: Semiconductors, by Chemical Composition
Table 6: Global Market for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 7: Global Market Volume for Semiconductor Wafers, by Crystal Growth Method, Through 2023
Table 8: Global Market for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 9: Global Market Volume for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
Table 10: Global Market for Semiconductor Wafers, by Node Size, Through 2023
Table 11: Global Market Volume for Semiconductor Wafers, by Node Size, Through 2023
Table 12: Global Market for Semiconductor Wafers, by Region, Through 2023
Table 13: Global Market Volume for Semiconductor Wafers, by Region, Through 2023
Table 14: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, Through 2023
Table 15: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Crystal Growth Method, Through 2023
Table 16: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Crystal Growth Method, Through 2023
Table 17: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 18: Global Market Volume for Semiconductor Wafers, in Telecommunications End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 19: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Node Size, Through 2023
Table 20: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Node Size, Through 2023
Table 21: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 22: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
Table 23: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, Through 2023
Table 24: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 25: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
Table 26: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 27: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 28: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 29: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
Table 30: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 31: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
Table 32: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, Through 2023
Table 33: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 34: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
Table 35: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 36: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 37: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 38: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
Table 39: Global Market for Semiconductor Wafers in Healthcare End-Use Applications by Region, Through 2023
Table 40: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Region, Through 2023
Table 41: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, Through 2023
Table 42: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 43: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
Table 44: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 45: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 46: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 47: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
Table 48: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 49: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
Table 50: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, Through 2023
Table 51: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 52: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
Table 53: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 54: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 55: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size Through 2023
Table 56: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size, Through 2023
Table 57: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 58: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
Table 59: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, Through 2023
Table 60: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 61: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
Table 62: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 63: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 64: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 65: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
Table 66: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 67: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
Table 68: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, Through 2023
Table 69: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Crystal Growth Method, Through 2023
Table 70: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Crystal Growth Method, Through 2023
Table 71: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 72: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
Table 73: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 74: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
Table 75: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Region, Through 2023
Table 76: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Region, Through 2023
Table 77: U.S. Patents on Semiconductor Wafer Technologies, by Patent Category, 1976 Through Aug. 2018
Table 78: U.S. Patent Trends: Semiconductor Wafer Technologies, by Year Granted, 1976 Through Aug. 2018
Table 79: U.S. Patent Shares of Semiconductor Wafer Technologies, by Assignee's Country, 1976 Through Aug. 2018
Table 80: U.S. Patent Holders of Semiconductor Wafer Technologies, 1976 Through Aug. 2018
Table 81: Patent Holders with Three or More U.S. Patents on Food Processing and Food Packaging Technologies, 1976 Through July 2018

List of Figures

Summary Figure: Global Market for Semiconductor Wafers, Through 2017-2023
Date of Publication:
Nov 20, 2019
File Format:
PDF via E-mail
Number of Pages:
163 Pages