IC Design and Packaging Technologies

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System-in-Package (SiP) Technology - Global Strategic Business Report
System-in-Package (SiP) Technology - Global Strategic Business Report
US$4,950.00
Date of Publication: Jun 5, 2017
This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.
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3D TSV: Insight On Critical Issues And Market Analyses
3D TSV: Insight On Critical Issues And Market Analyses
US$2,495.00
Date of Publication: Mar 28, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.
System-On-A-Chip - Global Strategic Business Report
System-On-A-Chip (SOCs) - Global Strategic Business Report
US$4,950.00
Date of Publication: Sep 21, 2016
This report analyzes the worldwide markets for System-on-A-Chip in US$ Million by the following Types: Mixed Signal SoCs, and Others. The Global market is further analyzed by the following End-Use Segments: Computers, Communication Equipment, Consumer Appliances, Automotive Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022.
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ARM in Embedded Processing Market Opportunities
Opportunities for ARM in Embedded Processing - 2015 Edition
US$6,500.00
Date of Publication: Jun 26, 2015
Analysis of trends in 24 application areas for: 32-bit ARM MCUs, 64-bit ARM MCUs, 32-bit ARM eMPUs, 64-bit ARM eMPUs, 32-bit ARM ASICs/ASSPs, 64-bit ARM ASICs/ASSPs, 32-bit ARM FPGAs, 64-bit ARM FPGAs, 32-bit ARM DSPs and 64-bit ARM DSPs. Forecasts to 2020. 
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ASICs, ASSPs and PLDs/FPGAs - Market Research Report
ASICs, ASSPs & PLDs/FPGAs – 2015 Edition
US$6,000.00
Date of Publication: Apr 21, 2015

This study provides coverage of the world market for classic ASICs, 32/64-bit MPU core-based ASICs, classic ASSPs, 32/64-bit MPU core-based ASSPs and PLDs/FPGAs. It is an update of the study last published by Semicast on this market in 2013 and provides analysis segmented into 25 application areas.

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FPGA Market Trends & Forecasts From 2014-2020
FPGA Market Trends & Forecasts 2014-2020
US$4,650.00
Date of Publication: Jan 28, 2015
The FPGA market is expected to jump up to $8.5 billion in 2020 at a CAGR of 8.1% from 2014-2020 due to the increasing use of field-programmable gate array in various application sectors such as medical, telecom, automotive etc. The new high-end applications have FPGA as their integral part; moreover the miniaturization is the main reason behind the growth of the process node technology. The low NRE cost per design, dramatic increase in ASIC design cost and continuous penetration in new application market are the major drivers for the field-programmable gate array market, as well as more number of technological advancement is taking place in FPGA market along with process node technology leading to the need for new field-programmable gate array in market. North America region occupies major market share of the field-programmable gate array market, with having some of the major players based in the U.S.
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Future Trends of the Worldwide TSV 3D IC Industry
Future Trends of the Worldwide TSV 3D IC Industry
US$1,600.00
Date of Publication: Dec 15, 2014
Worldwide TSV 3D IC Market Electronics devices are developing towards more compact form factors, more versatility, higher performance, and lower power...