Interconnect Components

The electronic interconnection industry includes manufacturers of electronic products and the printed circuit boards (PCBs) that are their foundation, electronics manufacturing services (EMS) companies, and suppliers of materials and equipment to those manufacturers.

US$2,495.00
Date of Publication: Jun 1, 2016
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$600.00
Date of Publication: Oct 2, 2015
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements.

US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

US$2,200.00
Date of Publication: Oct 1, 2015
Presently, the high-end relay market in China is principally monopolized by foreign brands such as Omron, Panasonic and TE Connectivity, while the low-end market is controlled by local Chinese players like Hongfa Technology, Dongguan Sanyou Electrical Appliances, Zhejiang HKE, Ningbo Forward Relay and Guizhou Space Appliance.

US$152.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$4,500.00
Date of Publication: Jul 25, 2015
Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining importance as a highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically by employing TSVs. The 3D TSV devices offer numerous benefits in wafer/chip assembly, which include superior performance as compared to conventional techniques, reduction in package size, heterogeneous integration, and superior performance. Driven by the growing demand for innovative, high-performance chip architectures featuring benefits such as superior performance, power consumption and form factor features, 3D TSV technology is making robust progress in the semiconductor industry.

US$3,995.00
Date of Publication: Feb 13, 2015
The so-called “interconnect bottleneck is creating opportunities for optical device and cable makers or all kinds. Process scaling, power consumption...