IPC-0040 Optoelectronic Assembly and Packaging Technology

IPC-0040 Optoelectronic Assembly and Packaging Technology

Date of Publication: May 1, 2003, 163 Pages
US$152.00
IPC-0040

This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. 

Date of Publication:
May 1, 2003
File Format:
Non-Printable CD-ROM
Number of Pages:
163 Pages
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