IPC- 2225  Sectional Design Standard for Organic Multichip Modules (MCM L) and MCM L Assemblies

IPC- 2225 Sectional Design Standard for Organic Multichip Modules (MCM L) and MCM L Assemblies

Date of Publication: Dec 1, 1998, 44 Pages
US$119.00
IPC-2225

ANSI Approved. Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. 44 pages. Released May 1998.

Date of Publication:
Dec 1, 1998
File Format:
Non-Printable CD-ROM
Number of Pages:
44 Pages
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