IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films

IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films

Date of Publication: Nov 1, 1996, 25 Pages
US$85.00
IPC-3408
IPC-3408 document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages. Released November 1996.

Date of Publication:
Nov 1, 1996
File Format:
Non-Printable CD-ROM
Number of Pages:
25 Pages
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