IPC-4103A Specification for Base Materials for High Speed/High Frequency Applications

IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications

Date of Publication: Nov 17, 2017, 67 Pages
US$130.00
IPC-4103A

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103B also allows the use of low permittivity (dielectric constant) glass reinforcements for laminates and bonding materials, thus improving both the permittivity and loss tangent properties of the materials conforming to this specification.

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Date of Publication:
Nov 17, 2017
File Format:
PDF Download, Book
Number of Pages:
67 Pages