IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline

IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline

Date of Publication: Nov 1, 2007, 19 Pages
US$85.00
IPC-4563

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007. Included in the IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.

Date of Publication:
Nov 1, 2007
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
19 Pages
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