This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
1.1 Statement of Scope This specification establishes and defines the qualification and performance requirements for the
fabrication of rigid printed boards.
1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed
boards based on the following constructions and/or technologies. These requirements apply to the finished product unless
• Single-sided, double-sided printed boards with or without plated-through holes (PTHs).
• Multilayer printed boards with PTHs with or without buried/blind vias/microvias.
• Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components.
• Metal core printed boards with or without an external metal heat frame, which may be active or non-active.
1.2.1 Supporting Documentation IPC-A-600, which contains figures, illustrations and photographs that can aid in the
visualization of externally and internally observable acceptable/nonconforming conditions, may be used in conjunction with
this specification for a more complete understanding of the recommendations and requirements.
1.3 Performance Classification and Type
1.3.1 Classification This specification establishes acceptance criteria for the performance classification of rigid printed
boards based on customer and/or end-use requirements. Printed boards are classified by one of three general Performance
Classes as defined in IPC-6011.
188.8.131.52 Requirement Deviations Requirements deviating from these heritage classifications shall be as agreed between
user and supplier (AABUS).
184.108.40.206 Space Requirement Deviations Space performance classification deviations are provided in the IPC-6012DS
Addendum and are applicable when the addendum is specified within the procurement documentation.
1.3.2 Printed Board Type Printed boards without PTHs (Type 1) and with PTHs (Types 2-6) are classified as follows and
may include technology adders as described in Table 1-1:
Type 1 — Single-Sided Printed Board
Type 2 — Double-Sided Printed Board
Type 3 — Multilayer Printed Board without blind or buried vias
Type 4 — Multilayer Printed Board with blind and/or buried vias (may include microvias)
Type 5 — Multilayer metal core Printed Board without blind or buried vias
Type 6 — Multilayer metal core Printed Board with blind and/or buried vias (may include microvias)
1.3.3 Selection for Procurement Performance class shall be specified in the procurement documentation.
The procurement documentation shall provide sufficient information to fabricate the printed board and ensure that the user
receives the desired product. Information that should be included in the procurement documentation is to be in accordance
with IPC-2611 and IPC-2614.
The procurement documentation shall specify the thermal stress test method to be used to meet the requirement of 3.6.1.
Selection shall be from those depicted in 220.127.116.11, 18.104.22.168 and 22.214.171.124. If not specified (see 5.1), the default shall be per Table