IPC-6015  Qualification and Performance Specification for Organic Multichip Module (MCM L) Mounting and Interconnecting Structures

IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM L) Mounting and Interconnecting Structures

Date of Publication: Feb 2, 1998, 25 Pages
US$85.00
IPC-6015(E)1

IPC-6015 establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.

Date of Publication:
Feb 2, 1998
File Format:
Non-Printable CD-ROM
Number of Pages:
25 Pages
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