IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

Date of Publication: May 4, 1999, 55 Pages
US$85.00
IPC-6016(E)1

IPC-6016 document establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. Key concepts include: HDI conductive surface requirements, microvia integrity, HDI electrical properties and end use application slash sheets. For use with IPC-6011-6012. 55 pages. Released May 1999.

Date of Publication:
May 4, 1999
File Format:
Non-Printable CD-ROM
Number of Pages:
55 Pages
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