IPC-7530 IT Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes

IPC-7530 IT Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes

Date of Publication: May 1, 2001, 18 Pages
US$85.00
IPC-7530

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for the construction of appropriate profiling test vehicles and various techniques and methodologies for temperature profiling. 18 pages. Released May 2001.

Date of Publication:
May 1, 2001
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
18 Pages
Type the characters you see in the picture above.