IPC-9504 Assembly Process Simulation for Evaluation of Non IC Components

IPC-9504 Assembly Process Simulation for Evaluation of Non IC Components

Date of Publication: Aug 3, 1998, 23 Pages
US$85.00
IPC-9504(E)1

IPC-9504(E)1 document addresses preconditioning of non-IC components used in electronic assembly. Will the components work with your process? The goal of these manufacturing process simulations is to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 23 pages. Released August 1998. Preview the table of contents .pdf file.Included in the E-500 Collection.

Date of Publication:
Aug 3, 1998
File Format:
Non-Printable CD-ROM
Number of Pages:
23 Pages
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