IPC 9702-WAM1 Monotonic Bend Characterization of Board-Level Interconnects

Date of Publication: Jul 22, 2015, 16 Pages

This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links. 

Included in the IPC-C-103 and the IPC-C-1000 Collections.

Date of Publication:
Jul 22, 2015
File Format:
Non-Printable CD-ROM
Number of Pages:
16 Pages