The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Supersedes IPC-A-600H.
This document provides many updates, including: