IPC-AJ-820, Assembly and Joining Handbook, has been updated to give users up-to-date information on everything from handling to design to soldering and testing. This handbook (includes CD-ROM) contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies.
It doesn't matter whether workers have been involved in a field for 10 months or 10 years. They'll at least occasionally find an area where they're not sure how to proceed. Having a state-of-the-art handbook available can be the quickest way to find the solution.
For a broad number of designers and manufacturing personnel in the printed circuit board supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice. That broad audience will now be able to find up-to-date information that's been collected by a diverse group from many segments of the supply chain over the past couple years.
The document covers all aspects involved with creating a printed circuit board, ranging from design and board structure through assembly and test. It covers basics, beginning with terms and definitions. Then things start getting more technical, addressing everything from the initial starting points such as design and component mounting before closing with the final steps in manufacturing, quality assurance and testing.
"IPC-AJ-820 covers 14 topics in 289 pages, everything from handling to design to component selection and soldering. Coating and encapsulation are also included," said Kris Roberson, IPC's manager of assembly technology. "It gives people basic data and directs them to places where they can get more nitty gritty, down and dirty information."
That said, there's plenty of in-depth information in the document. Equations for designers are included, as are discussions of tin whiskers and techniques for tin whisker mitigation. There's also a section called "Tin Pest," which explains that parts with high tin content can break down to powder under certain conditions.
This information was compiled by pulling best practices information from a number of sources and determining which steps were most useful to the typical user. A number of leading OEMs and research facilities like NASA and Naval Surface Weapons Crane provided input, as did committee members from a range of suppliers throughout the many assembly and joining fields.
It's not just the technology that's changed. Users who compare the existing version to the current document will also note that there's been a huge change in the way information is presented. The style and tone of the handbook is dramatically different.