IPC-D-279  Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Date of Publication: Jul 1, 1996, 137 Pages
US$152.00
IPC-D-279

IPC-D-279 establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.

Date of Publication:
Jul 1, 1996
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
137 Pages
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