IPC-J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps

IPC-J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps

Date of Publication: Aug 2, 1999, 36 Pages
US$88.00
IPC-J-028(E)1

IPC-J-STD-028 standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set of designations and expectations for product performance for the manufacturer and the user of flip chip or chip scale devices. Recommendations are provided to implement the best commercial practices and evolving process improvements. 36 Pages. Released August 1999.

Date of Publication:
Aug 2, 1999
File Format:
Non-Printable CD-ROM
Number of Pages:
36 Pages
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