IPC-J-STD-033C Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components

IPC-J-STD-033C Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components

Date of Publication: Feb 1, 2012, 18 Pages
US$85.00
IPC-J-STD-033C

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components.

These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components.

These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

18 pages. Released February 2012.


 

Date of Publication:
Feb 1, 2012
Number of Pages:
18 Pages
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