Updated with extended support for components used for lead free assembly!
J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 14 pages. Released March 2008.