IPC-SM-784 Guidelines for Chip on Board Technology Implementation

IPC-SM-784 Guidelines for Chip on Board Technology Implementation

Date of Publication: Nov 3, 1990, 37 Pages
US$119.00
IPC-SM-784

IPC-SM-784 discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.

Date of Publication:
Nov 3, 1990
File Format:
Non-Printable CD-ROM
Number of Pages:
37 Pages
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