IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
 
Please note that IPC site licenses are no longer available, all IPC standards must be purchased as single-user licenses, but you can select as many quantities (single user licenses) as you need based on the number of end-users.  The number of licenses can be modified by going to the "View Cart" option.
US$125.00
Date of Publication: Jun 1, 2000
Published jointly with the Japan Printed Circuits Association, IPC-JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures.

US$160.00
Date of Publication: Mar 1, 2007
IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications.

US$125.00
Date of Publication: Jul 3, 2000
The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A.

US$89.00
Date of Publication: Jul 1, 1996
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process...

US$89.00
Date of Publication: Nov 1, 1996
IPC-3408 document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components.

US$130.00
Date of Publication: Nov 17, 2017
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits.

US$200.00
Date of Publication: Jun 14, 2016
The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information.

US$160.00
Date of Publication: Feb 1, 2012
IPC-AJ-820, Assembly and Joining Handbook, has been updated to give users up-to-date information on everything from handling to design to soldering and testing. This handbook (includes CD-ROM) contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies.

US$125.00
Date of Publication: Oct 22, 1990
Provides guidelines for the design, selection and application of soldered surface mount connectors for all types of printed boards, rigid, flexible-rigid...

US$89.00
Date of Publication: Jan 1, 1995
IPC-CA-821 covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and...

US$89.00
Date of Publication: Oct 1, 2008
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability.

US$125.00
Date of Publication: Mar 1, 1998
IPC CF 152B covers the requirements for copper-invar-copper (CIC), copper-molybdenum- copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each type of composite metallic materials.

US$160.00
Date of Publication: Jul 1, 2011
IPC CS-65B updated for new technologies including lead-free, no-clean and environmentally friendly chemistries. This is a collection of information...

US$160.00
Date of Publication: Jan 1, 2004
IPC-CM-770E revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent...

US$160.00
Date of Publication: Jul 1, 1996
IPC-D-279 establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations.

US$125.00
Date of Publication: Jun 1, 1991

IPC-D-310C document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality assurance. 


US$305.00
Date of Publication: Oct 18, 2016
Le guide définitif illustré de l’acceptabilité des circuits imprimés. Ce document de référence en couleur défini et illustre avec des photos et des dessins, les critères « objectifs », « acceptables » et « non conformes » qui sont observables en interne ou en surface des circuits imprimés. Assurez vous que vos opérateurs, vos contrôleurs et vos ingénieurs possèdent les informations les plus récentes issues du consensus industriel.

US$89.00
Date of Publication: Aug 1, 2013
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products. The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow.

US$160.00
Date of Publication: Sep 25, 2013
IPC A-630 contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end-users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the reliability and function of the end-item assembly for its intended design life.

US$223.00
Date of Publication: Nov 20, 2012
IPC-2221B ist die Basisrichtlinie für das Design und bildet die Grundlage für alle Dokumente der IPC-2220-Serie. Sie legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischenMaterialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest.

US$182.00
Date of Publication: Dec 8, 2010
Gemeinsam mit IPC-2221 verwendet, legt IPC-2222 die spezifischen Anforderungen an das Design starrer, organischer Leiterplatten und weiterer Formen der...

US$234.00
Date of Publication: Jul 31, 2015
本書はIPCの製品保証分科会(7-30及び7-30C)のタスクグループ(7-31B)、 タスクグループアジア(7-31BC),タスクグループ北欧(7-31BD)、タス クグループドイツ語圏(7-31BDE)そしてタスクグループインド(7-31BI) を含めたIPC-A-610チームにより作成されたものである。 本書は、セレスティカ・ジャパン株式会社及び武井利泰⽒(⽇本精⼯株 式会社)により翻訳され、株式会社ジャパンユニックスにより、改版・監 修が⾏われた。 本書

US$160.00
Date of Publication: Jun 24, 2014
This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to meet requirements — ensuring the reliability and function of the end-item assembly for its intended design life. 

US$160.00
Date of Publication: Sep 15, 2016
This IPC standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

US$89.00
Date of Publication: Mar 9, 2010
This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information.

US$125.00
Date of Publication: Mar 10, 2010
This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products.

US$89.00
Date of Publication: Mar 10, 2010
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products.

US$125.00
Date of Publication: Mar 17, 2010
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product.

US$125.00
Date of Publication: Aug 26, 2014
IPC-4103A-WAM1 specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits.

US$118.00
Date of Publication: Aug 17, 2011
Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen...

US$89.00
Date of Publication: Aug 11, 2010
行业内唯一一份关于印制板操作、包装和贮存的指南。本文件中的指南是为了保护印制板,避免其受到污染、物理损伤、可焊性降低和吸潮。还给出了以下需 考虑的因素:包装材料类型和方法、生产环境、产品操作和运输、建立推荐的湿气水平、建立去除湿气的烘烤曲线以及烘烤对印制板可靠性的影响。...

US$125.00
Date of Publication: Sep 2, 2014
结合使用IPC-2221,IPC-2222为刚性有机印制板的设计和其他形式的元件贴装和互连结构建立了专用的设计要求。本标准适用于单面、双面、或多 层板。本文的关键概念是:刚性层压板的性能、印制板组件的设计要求、以及孔/互连的设计要求。A版本不仅提供了新的设计指导,而且还对介质间距、无铅层压...