IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
 
Please note that IPC site licenses are no longer available, all IPC standards must be purchased as single-user licenses, but you can select as many quantities (single user licenses) as you need based on the number of end-users.  The number of licenses can be modified by going to the "View Cart" option.
US$180.00
Date of Publication: Oct 17, 2017
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components’ substrate structure.

US$160.00
Date of Publication: Oct 17, 2017
The IPC-J-STD-003C-WAM1&2 standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes (PTHs). The IPC-J-STD-003C-WAM1&2 standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. 

US$90.00
Date of Publication: Oct 16, 2017
PC-9505  standard establishes uniform methods for testing electronic and electrical component parts, including both static and dynamic cleaning exposure tests to determine resistance to deleterious effects from exposure to the cleaning agent and mechanical energy used to deliver the cleaning agent to the part. For this document, the term "component parts" includes such items as capacitors, resistors, switches, relays, transformers, inductors, and others.

US$47.00
Date of Publication: Jul 24, 2017
DRM-WHA-C explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. This handy reference and training tool is a great way to help explain the most important requirements from the industry standard on Wire Harness Acceptability, IPC/WHMA-A-620C. Using easy-to-understand computer-generated graphics and language geared toward factory-level employees, this guide will help ensure that your company products meet the required industry standards.

US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.


US$280.00
Date of Publication: Jul 18, 2017
Ceci est la révision la plus récente de l’unique norme de consensus industriel sur les Exigences et Critères d’Acceptation pour l’Interconnexion des Faisceaux de Fils et de Câbles, et elle inclut de nouveaux chapitres sur le câblage de sécurité, les câbles de sécurité, les passe câbles et les chemins de câbles ainsi que des informations mises à jour dans de nombreux chapitres. 

US$338.00
Date of Publication: Jul 17, 2017
PtdEleFAM, "Printed Electronics Family" is a set of IPC documents for printed electronics.

US$533.00
Date of Publication: Jul 17, 2017
IPC-4550-FAM is a family of IPC specifications for plating for printed boards. This document collection includes IPC-4552 and IPC-4553 Specification for Immersion Silver Plating for Printed Boards and other IPC Plating Specs.

US$515.00
Date of Publication: Jul 17, 2017
This is a family of specifications on soldering materials and solderability testing used in the printed board assembly processes.

US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$160.00
Date of Publication: Jul 30, 2015
The scope of the industry standards for the collection of visual quality acceptability requirements on electronic components. This standard does not provide guidelines for the cross-sectional assessment. This document describes the manufacture of electrical and electronic components acceptance requirements. From a historical perspective, electronic assembly standards include guidelines more widely within the industry and technology involved. Therefore, in order to more fully understand the recommendations and requirements of this document, which can use IPC-HDBK-001, IPC-AJ-820 and IPC J-STD-001 when the application of this document. The requirements of this standard, neither intended to define the purpose of the assembly operation to complete the process, but also not intended as a repair / modify or alter authorized products. For example: The standard components in the bonding requirement does not imply, or approval of, or necessarily require the use of adhesive bonding; lead clockwise winding terminals description is not intended, or approved, or must require that all leads / clockwise winding wires have. Users of this standard should have some knowledge in order to be able to understand the applicable requirements of documents and how to apply. It should be retained with the objective evidence to prove this knowledge. When there is no objective evidence, companies should consider the skills of employees is reviewed regularly to determine proper eye test income requirements. IPC-A-610 contains the operating method IPC J-STD-001 included in the scope, the relevant requirements of mechanical assembly and other processes beyond the requirements. Table 1-1 lists the relevant documents.

US$160.00
Date of Publication: Jun 1, 2010
IPC-7351B includes both the standard and a downloadable IPC-7351 Calculator for land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately. The tool also allows for modification of dimensional attributes of IPC approved land patterns.

US$89.00
Date of Publication: Apr 19, 2016
Standard for use by printed board manufacturers in development of procedures for the protection of intellectual property (IP) for their customers, also serves as basis for certification by IPC audit demonstrating compliance with standard.

US$47.00
Date of Publication: Jan 23, 2017

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.

 


US$45.00
Date of Publication: Jun 8, 2015
Now updated to Revision F of the latest IPC-A-610 this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.

US$160.00
Date of Publication: Sep 8, 2016
New Revision C and Space Addendum for IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
To provide updated requirements for the qualification and performance of high frequency (microwave) printed boards, IPC has released revision C for IPC-6018, as well as a corresponding addendum (IPC-6018CS) for space and military avionics applications. The revision represents a completion of the overall update to the IPC-6010 series board performance documents with new criteria for HDI/microvia features previously found in the cancelled IPC-6016 specification.

US$89.00
Date of Publication: Sep 8, 2016
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

US$234.00
Date of Publication: Dec 17, 2015
Cette norme couvre les définitions et les propriétés des circuits imprimés rigides, incluant les simple-faces, les double-faces, avec ou sans trous métallisés, les multicouches avec ou sans vias borgnes/enterrés et les circuits à âmes métalliques. Elle décrit les besoins en finitions et en renforts électrolytiques, les conducteurs, les trous et les vias, les fréquences de contrôles d’acceptabilité et les critères de qualité requis ainsi que les exigences électriques, mécaniques et environnementales.

US$160.00
Date of Publication: Sep 28, 2015
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. 

US$345.00
Date of Publication: Jun 8, 2016
This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A.

US$89.00
Date of Publication: Jun 29, 2016
IPC-6012DA replaces specifically identified requirements of IPC-6012D Revision D for rigid printed boards.

US$125.00
Date of Publication: Jan 19, 2016
IPC-4562A-WAM1 covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. The Amendment 1 that has been inserted into the base document added back the light cold rolled-wrought copper foil (/6 [Cu-W6] that was previously removed during the revision A actions. Unless otherwise agreed upon between the user and supplier (AABUS), metal foils shall be considered acceptable, so long as the requirements in this specification are met.

US$234.00
Date of Publication: Dec 15, 2015
La J-STD-001F est reconnue mondialement comme la seule norme de consensus industriel couvrant les procédés et les matériaux de brasage. Cette révision inclut des informations techniques pour la fabrication à la fois avec des alliages traditionnels et sans-plomb. Des exemples de certains des changements significatifs sont la révision des exigences minimum de remplissage des trous métallisés ; des critères pour deux nouveaux types de terminaisons TMS ; et des critères étendus pour les vernis de tropicalisation. Chaque fois que cela a été possible, les descriptions des critères ont été ajustées pour les rendre plus faciles à comprendre pour les matériaux, les méthodes et pour la vérification de la réalisation d’assemblages et d’interconnexions brasées de qualité. Les exigences pour les trois classes de produit sont inclues.


US$223.00
Date of Publication: Jul 30, 2015
IPC-A-610 является наиболее широко используемым в мире стандартом по сборке электроники. Являясь обязательным для всех отделов обеспечения качества и сборки, IPC-A-610F иллюстрирует принятые отраслью критерии качества для электронных сборок, посредством детально описанных условий приемлемости и дефекта, подкрепленных полноцветными фотографиями и иллюстрациями. Это издание включает в себя два новых типа контакта ТПМ, а также изменения в критериях для заполнения металлизированных отверстий и пустот в паяных соединениях BGA. Кроме того, формулировки по возможности были изменены, чтобы облегчить восприятие текста и повысить понимание - и все это без удаления каких-либо требований.

US$160.00
Date of Publication: Jul 30, 2015
El IPC-A-610 es el estándar de ensambles electrónicos más utilizado del mundo. Es indispensable para todos los departamentos de aseguramiento de calidad y de ensamble, el IPC-A-610F ilustra los criterios de calidad aceptados por la industria para ensambles electrónicos a través de descripciones detalladas reflejando las condiciones aceptables y de defecto, apoyado por fotografías a todo color e ilustraciones. Esta revisión incluye dos nuevos tipos de terminaciones SMT y también cambios en el llenado de orificios through-hole metalizados y en los criterios para vacíos en BGAs. Además, siempre cuando ha sido posible se han modificado las descripciones para facilitar la lectura y mejorar la comprensión - todo sin eliminar ningún requisito.

US$467.00
Date of Publication: Nov 1, 2007
IPC 7711/21B-FR in French language. Ce guide inclue tout le nécessaire pour réparer et reprendre les assemblages électroniques et les circuits imprimés! L’IPC 771B/7721B Reprise, Modification et Réparation des assemblages électroniques a subi une mise à jour complète procédure par procédure pour en assurer l’applicabilité aux assemblages sans plomb comme aux traditionnels brasés en plombé. Ce volume unique inclue tous les modifications publiées précédemment et plusieurs nouvelles procédures pour les BGA (incluant le rebillage) et la réparation des circuits imprimés souples.

US$234.00
Date of Publication: May 20, 2015
IPC-A-610 er den mest udbredte godkendelsesstandard for elektronikprodukter. Et must for alle kvalitetssikrings- og produktionsafdelinger. IPC-A-610F...

US$234.00
Date of Publication: Apr 2, 2010
IEC는 IPC-A-610을 전자 어셈블리에 대한 전세계적으로 선호되는 국제적인 허용 규격으로서 이를 승인하는 과정에 있다. IPC-A-610은 세계에서 가장 널리 사용되는 전자 어셈블리 표준이다. 모든 품질 보증 및 어셈블리 부서들에 대해 하나의 필수적인 표준으로서,...

US$234.00
Date of Publication: Oct 28, 2015
IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning och är ett måste för alla...

US$234.00
Date of Publication: Oct 5, 2012

Die Revision B stellt die einzige, von der Industrie anerkannte Richtlinie für die Anforderungen und die Akzeptanz von Kabeln und Kabelbaum-Baugruppen dar. IPC und die Wire Harness Manufacturers Association (WHMA) haben ihre Zusammenarbeit fortgesetzt, um diese maßgebliche Aktualisierung zu erstellen. Diese Revision enthält stark erweiterte Kriterien für das Spritzgießen, das Vergießen, das Spleißen, Crimpkontakte ohne Isolationsunterstützung, Schneidklemmverbindungen, Montage von Steckverbindern, starre und formbare Kabel, flexible Isolierumhüllungen, Besenbindungen, Prüfung und mehr!


US$160.00
Date of Publication: Oct 22, 2013
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met.

US$160.00
Date of Publication: Oct 9, 2013
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading. 

US$234.00
Date of Publication: Dec 27, 2012
IPC-9631 beinhaltet Betrachtungen und Erwägungen in Bezug auf die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des...

US$89.00
Date of Publication: Feb 3, 2010
本文件提供了可用于辅助组装、返工、维修和回收利用的标记、标签系统,并可识别以下项目: 1)使用无铅焊料或有铅焊料组装的组件; 2)二级互连端子涂覆层和材料为无铅或有铅的元器件; 3)在组装和返工制程中,不允许超过的元器件最大耐温值; 4)用于制作印制电路板的基材,包括无卤素树脂;...

US$234.00
Date of Publication: Nov 2, 2015
Az IPC-A-610 a világon legszélesebb körben használt elektronikai szerelvényekkel foglalkozó szabvány. Nem...

US$152.00
Date of Publication: Feb 28, 2012
IPC HDBK-001E is a companion reference to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. It describes materials, methods, and verification criteria that, when applied as recommended or required, will produce quality soldered electrical and electronic assemblies.

US$234.00
Date of Publication: Jan 20, 2015
IPC A-610F-RO IPC-A-610 este cel mai folosit standard din lume în industria electronică de asamblare. Ca o necesitate absolută pentru toate...

US$160.00
Date of Publication: Nov 2, 2012
¡NUEVO! Incluye criterios ampliados para el moldeado, encapsulado, empalmes, contactos de compresión sin soporte de aislamiento, conectores en línea con desplazamiento del aislamiento, conectorización, cables rígidos y flexibles, fundas flexibles, atados múltiples estilo retama, pruebas y mucho más.

US$160.00
Date of Publication: Dec 22, 2014
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.

US$85.00
Date of Publication: Jul 22, 2015
This publication is intended to characterize the fracture strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links. 

US$85.00
Date of Publication: Sep 28, 2015
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted testing methods.

US$160.00
Date of Publication: Feb 19, 2015
IPC J-STD-001F是全球公认的唯一一份达成行业共识的涵盖焊接材料和工艺的标准。F版本既支持传统焊料合金制造,也支持无铅制造。显著变化的例子如新版本修订了镀覆孔(PTH)的最小填充的要求、两种新型SMT焊端的要求以及敷形涂覆的要求。

US$223.00
Date of Publication: Jul 30, 2015

IPC-A-610 ist die weltweit am meisten verwendete Richtlinie zur Elektronik-Montage. Die IPC-A-610F, ein Muss für alle Qualitätssicherungs- und Montageabteilungen, illustriert anerkannte Abnahmekriterien für die Verarbeitungsqualität elektronischer Baugruppen. Sie enthält detaillierte Angaben über sowohl zulässige Zustände als auch Fehlerzustände und wird durch farbige Bilder und Illustrationen unterstützt. Diese Ausgabe beinhaltet zwei neue SMT-Anschlussarten sowie geänderte Kriterien bezüglich des Füllgrades durchmetallisierter Löcher und bezüglich Hohlräumen (Voids) bei BGA-Lötstellen. Darüber hinaus wurden, wo möglich, Formulierungen angepasst, um die Lesbarkeit zu verbessern und die Verständlichkeit zu erhöhen, ohne dabei Anforderungen zu entfernen.


US$234.00
Date of Publication: Jul 30, 2015
IPC J-STD-001F ist weltweit anerkannt als einzige, im Industrie-Konsens entwickelte Richtlinie für Lötmaterialien und -prozesse. Diese Ausgabe umfasst die Unterstützung für herkömmliche Lotlegierungen und für bleifreie Produktion. Beispiele für einige der wichtigsten Änderungen sind die Überarbeitung der Verfüllanforderungen für durchmetallisierte Löcher (PTH): Kriterien für zwei neue SMT-Anschlusstypen und erweiterte Konformitäts-Kriterien für die Schutzbeschichtung. Wenn möglich wurden die Beschreibungen der Kriterien überarbeitet, um die Anforderungen an Materialien, Methoden und Überprüfungen zur Produktion hochwertiger Lötverbindungen und Baugruppen leichter verstehen zu können.

US$160.00
Date of Publication: Jul 30, 2015
IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghiệp chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh họa màu sắc. Phiên bản này bao gồm hai kiểu bản cực SMT, cũng như những thay đổi ở các tiêu chuẩn chấp nhận cho yêu cầu điền chất hàn vào lỗ đâm xuyên có mạ và yêu cầu về lỗ rỗng cho các banh hàn của BGA. Thêm vào đó, các sửa đổi về cách thức diễn đạt các chi tiết nhằm làm việc đọc hiểu bộ tài liệu được dễ dàng và dễ hiểu hơn – tất cả những điểm này không loại bỏ đi những yêu cầu.

US$45.00
Date of Publication: Jun 8, 2015
Now updated to Revision F  of the latest IPC-A-610  and J-STD-001  this  Training & Reference Guide  illustrates critical...

US$304.00
Date of Publication: Feb 18, 2015
IPC 7711/21B-CN...

US$85.00
Date of Publication: Oct 20, 2014
IPC-J-STD-006C-CN 本标准规定了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、丝状、粉末状焊料及“专用”电子级焊料的命名原则、要求及测试方法。本标准是一个质量控制标准,无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料,应该按照ASTM...

US$85.00
Date of Publication: Mar 12, 2008
J-STD-020D.1新增了无铅组装所用元器件的相关内容!本标准的目的是确定对湿气诱发应力敏感的非气密固态表面贴装器件(SMD)的潮湿敏感等 级。它可用于确定SMD封装的初始可靠性认证应该采用的分级等级。从而能够对这些器件进行正确地包装、存储和操作,以避免其在随后的再流焊接操作时受到热...

US$85.00
Date of Publication: Feb 12, 2013
IPC J-STD-033C-CN 本文件的目的是,针对潮湿/再流焊敏感表面贴装器件,向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在...

US$152.00
Date of Publication: Jul 4, 2008
IPC-T-50H-CN 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语...

US$119.00
Date of Publication: Nov 4, 2008
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component...

US$119.00
Date of Publication: Mar 7, 2007
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment...

US$152.00
Date of Publication: Dec 12, 2012
本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。本标准的目的是对印制电路板组件中电子装联所 用的锡/铅和无铅焊接助焊剂材料进行分类和描述。这些焊接助焊剂材料包括:液态助焊剂、膏状助焊剂、焊膏、外涂助焊剂以及含助焊剂芯的焊丝和预成形焊料。...

US$85.00
Date of Publication: Feb 8, 2012
本标准列出了焊膏鉴定、特征描述的要求。本标准参考了有关金属含量、粘度、塌落、焊料球、粘附力、润湿等的测试方法及标准。IPC-HDBK-005 焊膏评估指南(不包含在本标准的购买中)提供了更多的支持。取代J-STD-005。共10页。于2012年2月发布。    

US$89.00
Date of Publication: Aug 14, 2008
J-STD-075主要涵盖了J-STD-020未涉及的内容,所提供的测试方法可针对电子元器件在最坏情况下对焊接组装工艺的限制进行分级,分级时采用 常见的波峰焊和再流焊工艺曲线,包括无铅工艺。分级代表最高的工艺敏感等级,并没有为组装厂建立返工条件或推荐工艺。它概述了非半导体元器件工艺敏感等级 (PSL)的分级和标识程序,潮湿敏感等级(MSL)符合半导体行业的分级(J-STD-020《非气密固态表面贴装器件潮湿/再流焊敏感度分级》和J- STD-033《潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用》)。J-STD-075取代IPC-9503。由ECA、IPC和JEDEC联 合开发。全文共12页,于2008年8月发布。2010年9月出版其中文版。

US$152.00
Date of Publication: Feb 7, 2005
J-STD-001D is world-recognized as the sole industry-consensus standard covering soldering materials and processes. This revision now includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610D. 

US$152.00
Date of Publication: Apr 17, 2013
本规范基于性能标准规定了使用浸银作为印制板表面处理的要求。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)、原始设备制造商 (OEM)。浸银是在铜面上沉积一层薄的银。它是一种多功能的表面处理,适用于焊接。也可应用在一些挤入式接触和表面接触。它适合打铝线。浸银保护下面的...

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本规范涵盖了按IPC-2221和IPC-2223进行设计的挠性印制板的鉴定及性能要求。挠性印制板可以是单面板、双面板、多层板或刚-挠多层 板。所有这些印制板的结构可以有或无增强板、镀覆孔(PTH)和盲/埋孔。B版本更新的内容包括:表面镀层、白斑、外来夹杂物、粘合剂挤出、可焊环宽、...

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Date of Publication: Mar 23, 2011
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战,BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中 BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP...

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Date of Publication: Oct 19, 2011
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计,其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表。共14页,2011年10 月出版。2013年6月翻译。   ...