IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.  

 

US$57.00
Date of Publication: Apr 1, 1999
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an...

US$82.00
Date of Publication: Jul 1, 1994
ML-960 specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing...

US$114.00
Date of Publication: Oct 1, 1993
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept-reject...

US$152.00
Date of Publication: May 1, 2003
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.

US$114.00
Date of Publication: Jan 3, 2005
This handbook has been developed to aid printed circuit board (PCB) manufacturers and users in completing Material Declarations that follow the format and...

US$85.00
Date of Publication: Apr 3, 2000
Choosing an Information Technology provider for a PWB manufacturing facility can be cumbersome and confusing. Most software systems do not have fields...

US$85.00
Date of Publication: Jun 5, 2002
This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the...