IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.  

PLEASE NOTE: Due to technology changes, CDs are being gradually phased out as a product format. Therefore, from September 2016, KITs for standards (hard copy plus single user CD) have been discontinued. 
US$5,034.00
Date of Publication: May 12, 2016
It takes a lot to be successful in electronics assembly: get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.

US$125.00
Date of Publication: Jan 19, 2016
IPC-4562A-WAM1 covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. The Amendment 1 that has been inserted into the base document added back the light cold rolled-wrought copper foil (/6 [Cu-W6] that was previously removed during the revision A actions. Unless otherwise agreed upon between the user and supplier (AABUS), metal foils shall be considered acceptable, so long as the requirements in this specification are met.

US$1,395.00
Date of Publication: Jan 15, 2016
Manufacturers and designers of flexible printed boards need unique information on materials, manufacturing and design for these specialized interconnections. Put it all at your finger tips with this comprehensive collection of IPC's 15 key documents for flexible printed boards. Save 55% on individual document prices.

US$2,246.00
Date of Publication: Dec 14, 2016
As a designer considering physical design principles, customer reliability requirements and surface mount and high-speed logic design, this new manual set provides an excellent compilation of standards essential to your library. Sharp focus is brought to bear on such aspects of printed board technology as high density interconnects, flexible printed board design, controlled impedance and Design for Reliability (DFR) procedures. Includes 23 IPC documents. Save 55% on individual document prices.

US$1,663.00
Date of Publication: Jan 14, 2016
With global materials restrictions adding to all the different recipes used in manufacturing board laminate, board specifiers and manufacturers need all the tools available. This collection of 19 documents contains the requirements for the various reinforcements, foils, laminates, and prepregs.

US$234.00
Date of Publication: Dec 15, 2015
La J-STD-001F est reconnue mondialement comme la seule norme de consensus industriel couvrant les procédés et les matériaux de brasage. Cette révision inclut des informations techniques pour la fabrication à la fois avec des alliages traditionnels et sans-plomb. Des exemples de certains des changements significatifs sont la révision des exigences minimum de remplissage des trous métallisés ; des critères pour deux nouveaux types de terminaisons TMS ; et des critères étendus pour les vernis de tropicalisation. Chaque fois que cela a été possible, les descriptions des critères ont été ajustées pour les rendre plus faciles à comprendre pour les matériaux, les méthodes et pour la vérification de la réalisation d’assemblages et d’interconnexions brasées de qualité. Les exigences pour les trois classes de produit sont inclues.

US$319.00
Date of Publication: Nov 28, 2007
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair.